Senior AI-Driven HBM Packaging Yield Engineer

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 110,000 - 170,000; Full time

Job summary

Micron Singapore is seeking a seasoned Product Engineer for HBM package and integration, driving yield, quality, and cost improvements across the HIG HBM PE portfolio.

You will lead cross-functional initiatives with Fab, Technology Development, and Packaging teams, mentor team members, and apply ML/AI techniques to optimize KPIs, with on-site work in Singapore and travel to Taiwan, US, and Japan. Experience in test flows and advanced packaging is preferred.

Qualifications

• Bachelor's or Master's degree in Electrical/Electronic/Mechanical Engineering.
• 5+ years in semiconductor industry.
• Experience in product engineering and packaging preferred.
• Strong root-cause analysis and problem solving skills.
• Familiar with statistics and data analysis tools; scripting.
• ML/AI experience a plus.
• Willing to work on-site in Singapore with travel to Taiwan/US/Japan.

Responsibilities

• ASM Yield and DPM Improvement: improve assembly-related coverage to reduce inline fallout.
• HBM Cube Yield Improvement through test optimization and coverage improvements.
• Lead cross-functional teams to enhance cumulative yield and quality.
• Root Cause and Resolution of Qual and RMA Packaging Issues with cross-functional collaboration.
• Process conversions with FAB, TD, and Packaging teams to improve yield and cost.
• Collaborate with Fab, TD, Design, System Development, and Quality teams to ship end products.
• Promote innovation and drive changes for competitive edge.
• Develop project management skills for timely delivery of solutions.
• Make technical decisions on risk analysis and project prioritization.
• Collaborate on AI/ML models to improve KPIs.

Skills

Electrical Engineering

Semiconductor Industry

Packaging Experience

Problem Solving

Statistics & Data Analysis

ML/AI

Leadership

Education

Bachelor's/Master's in Electrical/Electronic/Mechanical Engineering

Tools

Python scripting

Data analysis tools

Job description

Micron Singapore is seeking a seasoned Product Engineer for HBM package and integration, driving yield, quality, and cost improvements across the HIG HBM PE portfolio.

You will lead cross-functional initiatives with Fab, Technology Development, and Packaging teams, mentor team members, and apply ML/AI techniques to optimize KPIs, with on-site work in Singapore and travel to Taiwan, US, and Japan. Experience in test flows and advanced packaging is preferred.