HBM & NPI Packaging Engineer – AI-Enabled Innovation

Micron Technology, Inc; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

Micron Technology, Inc in Singapore seeks an Engineer for High Bandwidth Memory (HBM) & New Product Introduction (NPI). You will join the Package Development Engineering team, applying AI-assisted methods to accelerate DOE through product qualifications and enable transfer from development to high‑volume manufacturing.

You will collaborate with APDT and manufacturing, support LVM and RAR, and drive continuous improvement across advanced packaging technologies while aligning with Micron’s values

Qualifications

• Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or a related discipline.
• Minimum 2 years of experience in semiconductor related field
• Experience required in fan-in packaging process/advanced packaging technology
• Experience using SPC, DOE & JMP
• Operations support, including shift and weekend coverage, is required.
• Strong analytical, logical, and critical thinking skills
• Effective communicator, able to collaborate across all levels
• Growth mindset with a passion for continuous learning

Responsibilities

• Integrate AI-assisted tool and insights into daily work to improve efficiency, quality or effectiveness.
• Contribute to a culture of continuous improvement by identifying, testing and sharing AI-enablement enhancement within one scope of work.
• Apply engineering and statistical methods to accelerate learning cycles from Design of Experiments (DOE) through product qualifications.
• Partner with Advanced Package Technology Development (APTD) and manufacturing teams to support Low Volume Manufacturing (LVM) and Run at Risk (RAR).
• Perform risk assessments Failure Mode & Effect Analysis (FMEA) and implement effective control plans and corrective actions for abnormal conditions.
• Enable smooth technology transfer from development to high‑volume manufacturing.
• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Skills

AI literacy

DOE

SPC

JMP

Analytical thinking

Communication

Education

Bachelor's degree in Engineering

Tools

Python

JMP

MES systems

Job description

Micron Technology, Inc in Singapore seeks an Engineer for High Bandwidth Memory (HBM) & New Product Introduction (NPI). You will join the Package Development Engineering team, applying AI-assisted methods to accelerate DOE through product qualifications and enable transfer from development to high‑volume manufacturing.

You will collaborate with APDT and manufacturing, support LVM and RAR, and drive continuous improvement across advanced packaging technologies while aligning with Micron’s values