HBM Packaging Engineer - Yield & Innovation Leader

Micron Technology; Singapore; On-site; SGD 70,000 - 100,000; Full time

Job summary

Micron Technology in Singapore is seeking a qualified candidate with a degree in Electrical, Electronic, or Mechanical Engineering. The role involves improving assembly yield, collaborating on technical initiatives, and mentoring team members. You will handle project management and engage in technical decision-making, promoting innovation and AI/ML applications. Strong technical problem-solving skills and excellent communication are crucial, alongside a commitment to leadership and continuous learning.

Qualifications

• Strong technical skills in problem solving and circuit analysis.
• Good knowledge of statistics and data analysis.
• Excellent communication and presentation skills.

Responsibilities

• Improve assembly related coverage to enhance DPM.
• Collaborate on HBM Cube yield improvement.
• Lead initiatives to enhance cumulative yield.

Skills

Technical problem solving

Data analysis

Communication skills

Project management

Team leadership

Education

Bachelors/Masters in Electrical/Electronic/Mechanical Engineering

Tools

Statistics tools

Scripting

Job description

Micron Technology in Singapore is seeking a qualified candidate with a degree in Electrical, Electronic, or Mechanical Engineering. The role involves improving assembly yield, collaborating on technical initiatives, and mentoring team members. You will handle project management and engage in technical decision-making, promoting innovation and AI/ML applications. Strong technical problem-solving skills and excellent communication are crucial, alongside a commitment to leadership and continuous learning.