Lead Staff Engineer, HBM Packaging & Yield Innovation

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

1100 Micron SemiAsiaOP Pte Ltd in Singapore is seeking a passionate individual to join the HIG HBM Package Product Engineering team. This role involves leading a high-performing team to drive engineering activities, enhancing product yield and quality through effective collaboration.

The ideal candidate will hold a Bachelor's or Master's degree in Electrical, Electronic, or Mechanical Engineering and possess strong problem-solving skills. This opportunity involves onsite work in Singapore with potential travel to Taiwan, the US, and Japan.

Qualifications

• Competent technical skills, especially in problem solving.
• Knowledge of statistics and data analysis tools.
• Excellent communication and presentation skills.

Responsibilities

• Accountable for improving assembly related coverage.
• Leading impactful initiatives for yield and quality improvements.
• Mentor and develop team members.

Skills

Problem solving

Statistics

Data analysis tools

Team collaboration

Communication

Education

Bachelors/Masters in Electrical/Electronic/Mechanical Engineering

Job description

1100 Micron SemiAsiaOP Pte Ltd in Singapore is seeking a passionate individual to join the HIG HBM Package Product Engineering team. This role involves leading a high-performing team to drive engineering activities, enhancing product yield and quality through effective collaboration.

The ideal candidate will hold a Bachelor's or Master's degree in Electrical, Electronic, or Mechanical Engineering and possess strong problem-solving skills. This opportunity involves onsite work in Singapore with potential travel to Taiwan, the US, and Japan.