HBM Packaging Engineer - NPI & AI-Driven Manufacturing

Micron Technology; Singapore; On-site; SGD 70,000 - 95,000; Full time

Job summary

Micron Technology in Singapore is seeking Engineers to join the Package Development Engineering Team for Advanced Packaging, supporting next-generation memory and HBM packaging technologies from development to high-volume manufacturing.

The role collaborates with Development, Manufacturing and supplier teams across Micron's global network, applying AI-assisted tools and engineering methods to accelerate learning and transfer to high-volume production.

Qualifications

• Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or related discipline.
• Operations support, including shift and weekend coverage, is required.
• Strong analytical, logical, and critical thinking skills
• Effective communicator, able to collaborate across all levels
• Internship or experience in the semiconductor industry is a plus
• Demonstrated leadership and a track record of impact are highly desirable
• Interest in and knowledge of the semiconductor industry and Micron is preferred
• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.

Responsibilities

• Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness.
• Contribute to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.
• Apply engineering and statistical methods to accelerate learning cycles from Design of Experiments (DOE) through product qualifications.
• Partner with Advanced Package Technology Development (APTD) and manufacturing teams to support Low Volume Manufacturing (LVM) and Run at Risk (RAR).
• Perform risk assessments Failure Mode & Effect Analysis (FMEA) and implement effective control plans and corrective actions for abnormal conditions.
• Enable smooth technology transfer from development to high‑volume manufacturing.

Skills

Analytical skills

Communication

AI literacy

Leadership

Growth mindset

Team collaboration

Education

Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or related discipline

Tools

JMP

Python

Job description

Micron Technology in Singapore is seeking Engineers to join the Package Development Engineering Team for Advanced Packaging, supporting next-generation memory and HBM packaging technologies from development to high-volume manufacturing.

The role collaborates with Development, Manufacturing and supplier teams across Micron's global network, applying AI-assisted tools and engineering methods to accelerate learning and transfer to high-volume production.