Chip to Wafer Bonding Principal Scientist (APM), IME

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 70,000 - 95,000; Full time

Job summary

A leading research organization in Singapore is seeking a Research Scientist specializing in advanced Chip-to-Wafer bonding processes. Responsibilities include developing innovative bonding techniques, evaluating semiconductor performance, and collaborating with various stakeholders. A PhD in a relevant field is required, along with experience in semiconductor packaging. This role also emphasizes mentorship for junior staff. Competitive salary and professional development opportunities are offered.

Qualifications

• PhD required in a relevant engineering or science field.
• Experience in chip to wafer bonding process development preferred.
• Strong track record in advanced packaging technologies is advantageous.

Responsibilities

• Innovate and develop new C2W bonding capabilities.
• Conduct evaluations and characterize performance of bonded structures.
• Collaborate with internal and external stakeholders on process integration.
• Generate engineering reports and contribute to IP creation.
• Act as a subject matter expert and mentor others.

Skills

C2W bonding techniques

Advanced semiconductor packaging

Data analysis

Mentorship

Education

PhD in Materials Science

PhD in Mechanical Engineering

PhD in Physics

PhD in Chemistry

PhD in Electronics

PhD in Electrical Engineering

Job description

A research scientist working on Chip-to-Wafer (C2W) bonding processes primarily focuses on the development, optimization, characterization, and integration of advanced bonding techniques for semiconductor packaging and heterogeneous integration applications.

Job Description

Process Development and Optimization

• Innovate and develop new C2W bonding capabilities, including hybrid, fusion, thermocompression, and eutectic bonding methods.
• Investigate and refine related processes like wafer cleaning, planarization (CMP), and post-bonding annealing, addressing critical factors such as warpage, bonding strength, and alignment accuracy.

Evaluation and Characterization

• Plan and execute comprehensive evaluations of processes, materials, and equipment.
• Conduct experiments for process characterization, data collection, and analysis to drive quality improvements.
• Assess the thermal, mechanical, and electrical performance of the bonded structures, ensuring they meet the requirements for advanced applications like AI accelerators and 3D-ICs.

Project Collaboration and Integration

• Work closely with process integration teams, project leaders, and senior staff to align on project requirements and troubleshoot issues for industry and grant projects.
• Collaborate with internal and external stakeholders, including industry partners and equipment suppliers, to define technology roadmaps and develop next-generation capabilities.

Documentation and Intellectual Property

• Generate detailed engineering reports, research papers, and technical documents.
• Contribute to the creation of new intellectual properties (IPs), file patents, and document know-how related to heterogeneous integration platforms.
• Publish research findings in prestigious scientific journals and present at conferences.

Mentorship and Expertise

• Act as a subject matter expert (SME) for both internal and external stakeholders.
• Mentor and inspire scientists, engineers and talents in the field of advanced semiconductor packaging technology.

Job Requirements

• PhD in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering.
• Experience in chip to wafer bonding process development or packaging R&D, with a strong track record in advanced packaging technologies is added advantage.
• Relevant experience in semiconductor packaging or process development.