Backend Process Engineer – Wafer Bumping, Grinding, Mounting

RF360 SINGAPORE PTE. LTD.; Singapore; On-site; SGD 72,000 - 90,000; Full time

Job summary

RF360 Singapore PTE. LTD. is seeking a hands-on Process Engineer to support backend semiconductor packaging operations, focusing on wafer bumping, singulation, grinding/backgrind, and mounting.

You will analyze process data, troubleshoot issues, and drive improvements to meet production output, quality, efficiency, yield, cycle time, and safety targets. The role requires collaboration with production, equipment, quality, and planning teams in a fast-paced manufacturing environment.

Qualifications

• Bachelor’s Degree in Engineering or related discipline.

Responsibilities

• Provide engineering support for backend semiconductor packaging processes, including wafer bumping, wafer singulation, wafer grinding/backgrind, and wafer mounting.
• Monitor and analyse process data to identify trends, risks, and improvement opportunities.
• Lead troubleshooting for process abnormalities, yield loss, quality excursions, and production issues.
• Drive corrective and preventive actions to resolve chronic process and quality issues.
• Evaluate new products, materials, and processes during pilot runs for production readiness.
• Collaborate with production, equipment, quality, planning, and cross-functional teams to ensure smooth manufacturing execution.

Skills

Data analysis

Problem solving

Critical thinking

Communication

Planning

Collaboration

MS PowerPoint

MS Excel

MS Word

QC/SPC knowledge

Education

Bachelor’s Degree in Engineering

Tools

SPC

MSA

Job description

RF360 Singapore PTE. LTD. is seeking a hands-on Process Engineer to support backend semiconductor packaging operations, focusing on wafer bumping, singulation, grinding/backgrind, and mounting.

You will analyze process data, troubleshoot issues, and drive improvements to meet production output, quality, efficiency, yield, cycle time, and safety targets. The role requires collaboration with production, equipment, quality, and planning teams in a fast-paced manufacturing environment.