Process Engineer – Wafer Bumping, Wafer Singulation, Wafer Grinding & Wafer Mounting

RF360 SINGAPORE PTE. LTD.; Singapore; On-site; SGD 72,000 - 90,000; Full time

Job summary

RF360 Singapore PTE. LTD. is seeking a hands-on Process Engineer to support backend semiconductor packaging operations, focusing on wafer bumping, singulation, grinding/backgrind, and mounting.

You will analyze process data, troubleshoot issues, and drive improvements to meet production output, quality, efficiency, yield, cycle time, and safety targets. The role requires collaboration with production, equipment, quality, and planning teams in a fast-paced manufacturing environment.

Qualifications

• Bachelor’s Degree in Engineering or related discipline.

Responsibilities

• Provide engineering support for backend semiconductor packaging processes, including wafer bumping, wafer singulation, wafer grinding/backgrind, and wafer mounting.
• Monitor and analyse process data to identify trends, risks, and improvement opportunities.
• Lead troubleshooting for process abnormalities, yield loss, quality excursions, and production issues.
• Drive corrective and preventive actions to resolve chronic process and quality issues.
• Evaluate new products, materials, and processes during pilot runs for production readiness.
• Collaborate with production, equipment, quality, planning, and cross-functional teams to ensure smooth manufacturing execution.

Skills

Data analysis

Problem solving

Critical thinking

Communication

Planning

Collaboration

MS PowerPoint

MS Excel

MS Word

QC/SPC knowledge

Education

Bachelor’s Degree in Engineering

Tools

SPC

MSA

Job description

Job Summary:

We are seeking a motivated and hands-on Process Engineer to support backend semiconductor packaging operations, with primary focus on wafer bumping, wafer singulation, wafer grinding/backgrind, and wafer mounting processes. The successful candidate will provide day-to-day engineering support to meet production output, product quality, efficiency, productivity, yield, cycle time, and safety requirements. This role is ideal for an engineer who enjoys data-driven problem solving, continuous improvement, and working closely with cross-functional teams in a fast-paced manufacturing environment.

Key Responsibilities:

Process Engineering & Manufacturing Support

• Provide engineering support for backend semiconductor packaging processes, including wafer bumping, wafer singulation, wafer grinding/backgrind, and wafer mounting.

• Support daily production activities to achieve output, quality, efficiency, productivity, yield, cycle time, and safety targets.

• Monitor and analyse process data to identify trends, risks, and improvement opportunities.

• Lead troubleshooting and problem-solving activities for process abnormalities, yield loss, quality excursions, and production issues.

• Drive permanent corrective and preventive actions to resolve chronic process and quality issues.

• Evaluate new products, materials, and processes during pilot runs and ensure process readiness for production release.

• Work closely with production, equipment, quality, planning, and cross-functional teams to ensure smooth manufacturing execution.

Documentation, Compliance & Audit Support

• Maintain and ensure the relevance of Work Instructions, Control Plans, FMEA, and Process Control documents.

• Prepare production lines and process documentation for internal and external audits.

• Support audit follow-up actions and ensure timely closure of findings.

• Promote compliance with safety, quality, and manufacturing standards.

Continuous Improvement

• Identify and implement improvement actions to enhance process stability, productivity, yield, and cost effectiveness.

• Apply statistical and quality tools such as SPC, MSA, and structured problem-solving methods where applicable.

• Participate in cross-functional initiatives to improve manufacturing robustness and operational excellence.

Qualifications:

• Bachelor’s Degree in Engineering, preferably in Mechanical, Materials, Chemical, Manufacturing, or a related discipline.

• Preferably at least 2 years of relevant working experience as a Process Engineer in semiconductor assembly or backend manufacturing.

• Fresh graduates with strong technical aptitude and interest in semiconductor manufacturing may also be considered.

Required Skills & Competencies:

• Strong data analysis, problem-solving, and critical thinking skills.

• Good communication and collaboration skills, with the ability to work effectively with cross-functional teams.

• Good planning, organization, and follow-up skills.

• Ability to work under pressure and demonstrate strong commitment to achieving production and quality goals.

• Proficiency in Microsoft PowerPoint, Excel, and Word.

• Knowledge of statistical and quality tools such as SPC and MSA is preferred.

Ideal Candidate Profile:

• A proactive team player who is hands-on, detail-oriented, and comfortable working in a dynamic manufacturing environment.