Flip-Chip Process Engineer for Yield & Production

Qualcomm; Singapore; On-site; SGD 61,000 - 100,000; Full time

Job summary

RF360 Singapore Pte., Ltd. is seeking a Hardware Engineer to plan, design, verify, and test electronic systems, including packaging and test systems across Digital/Analog/RF domains in a collaborative, fast-paced environment.

The role emphasizes process engineering support, continuous improvement, and audit readiness, with opportunities to drive yield, quality, and efficiency while working with production, quality, and planning teams in a dynamic semiconductor manufacturing setting.

Qualifications

• Bachelor’s degree in Engineering (Mechanical, Materials, Chemical, Manufacturing, or related) or similar.
• 2+ years as a Process Engineer in semiconductor assembly/backend manufacturing preferred.
• Fresh graduates with strong technical aptitude may be considered.

Responsibilities

• Provide engineering support for backend semiconductor packaging processes, including flip chip bonding, reflow soldering and plasma cleaning.
• Support daily production activities to achieve output, quality, efficiency, productivity, yield, cycle time, and safety targets.
• Monitor and analyse process data to identify trends, risks, and improvement opportunities.
• Lead troubleshooting and problem-solving activities for process abnormalities, yield loss, quality excursions, and production issues.
• Drive permanent corrective and preventive actions to resolve chronic process and quality issues.
• Evaluate new products, materials, and processes during pilot runs and ensure process readiness for production release.
• Work closely with production, equipment, quality, planning, and cross-functional teams to ensure smooth manufacturing execution.
• Maintain and ensure the relevance of Work Instructions, Control Plans, FMEA, and Process Control documents.
• Prepare production lines and process documentation for internal and external audits.
• Promote compliance with safety, quality, and manufacturing standards.
• Identify and implement improvement actions to enhance process stability, productivity, yield, and cost effectiveness.
• Apply SPC and MSA tools where applicable.
• Participate in cross-functional initiatives to improve manufacturing robustness and operational excellence.

Skills

Data analysis

Problem-solving

Communication skills

Cross-functional collaboration

SPC knowledge

MSA knowledge

Education

Bachelor's degree in Electrical/Electronics Engineering

Tools

PowerPoint

Excel

Word

Job description

RF360 Singapore Pte., Ltd. is seeking a Hardware Engineer to plan, design, verify, and test electronic systems, including packaging and test systems across Digital/Analog/RF domains in a collaborative, fast-paced environment.

The role emphasizes process engineering support, continuous improvement, and audit readiness, with opportunities to drive yield, quality, and efficiency while working with production, quality, and planning teams in a dynamic semiconductor manufacturing setting.