Process Engineer – Wafer Bumping, Wafer Singulation, Wafer Grinding & Wafer Mounting

Qualcomm; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

Qualcomm in Singapore is looking for a motivated Process Engineer to support backend semiconductor packaging operations. The role involves providing engineering support for various processes including wafer bumping and singulation, and driving improvements in productivity and quality.

The candidate must have a Bachelor’s Degree in Engineering, with preferred experience in semiconductor manufacturing. Strong data analysis and problem-solving skills are essential.

Qualifications

• Bachelor's degree in Engineering, preferably in Mechanical, Materials, Chemical, Manufacturing, or a related discipline.
• At least 2 years of relevant working experience as a Process Engineer in semiconductor assembly or backend manufacturing.

Responsibilities

• Provide engineering support for backend semiconductor packaging processes.
• Support daily production activities to achieve output and quality goals.
• Monitor and analyze process data to identify improvement opportunities.
• Lead troubleshooting and problem-solving activities for production issues.
• Maintain relevant documentation for processes and standards.

Skills

Data analysis

Problem-solving

Communication skills

Collaboration skills

Proficient in Microsoft PowerPoint

Proficient in Microsoft Excel

Proficient in Microsoft Word

Education

Bachelor's Degree in Engineering or related field

Tools

Statistical Process Control (SPC)

Measurement System Analysis (MSA)

Job description

Company

RF360 Singapore Pte., Ltd.

Job Area

Engineering Group > Hardware Engineering

General Summary

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-gen experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring‑up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting‑edge, world‑class products. Qualcomm Hardware Engineers collaborate with cross‑functional teams to develop solutions and meet performance requirements.

Minimum Qualifications

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.

Job Summary

We are seeking a motivated and hands‑on Process Engineer to support backend semiconductor packaging operations, with primary focus on wafer bumping, wafer singulation, wafer grinding/backgrind, and wafer mounting processes. The successful candidate will provide day‑to‑day engineering support to meet production output, product quality, efficiency, productivity, yield, cycle time, and safety requirements. This role is ideal for an engineer who enjoys data‑driven problem solving, continuous improvement, and working closely with cross‑functional teams in a fast‑paced manufacturing environment.

Process Engineering & Manufacturing Support

• Provide engineering support for backend semiconductor packaging processes, including wafer bumping, wafer singulation, wafer grinding/backgrind, and wafer mounting.
• Support daily production activities to achieve output, quality, efficiency, productivity, yield, cycle time, and safety targets.
• Monitor and analyse process data to identify trends, risks, and improvement opportunities.
• Lead troubleshooting and problem‑solving activities for process abnormalities, yield loss, quality excursions, and production issues.
• Drive permanent corrective and preventive actions to resolve chronic process and quality issues.
• Evaluate new products, materials, and processes during pilot runs and ensure process readiness for production release.
• Work closely with production, equipment, quality, planning, and cross‑functional teams to ensure smooth manufacturing execution.

Documentation, Compliance & Audit Support

• Maintain and ensure the relevance of Work Instructions, Control Plans, FMEA, and Process Control documents.
• Prepare production lines and process documentation for internal and external audits.
• Support audit follow‑up actions and ensure timely closure of findings.
• Promote compliance with safety, quality, and manufacturing standards.

Continuous Improvement

• Identify and implement improvement actions to enhance process stability, productivity, yield, and cost effectiveness.
• Apply statistical and quality tools such as SPC, MSA, and structured problem‑solving methods where applicable.
• Participate in cross‑functional initiatives to improve manufacturing robustness and operational excellence.

Qualifications

• Bachelor’s Degree in Engineering, preferably in Mechanical, Materials, Chemical, Manufacturing, or a related discipline.
• Preferably at least 2 years of relevant working experience as a Process Engineer in semiconductor assembly or backend manufacturing.
• Fresh graduates with strong technical aptitude and interest in semiconductor manufacturing may also be considered.

Required Skills & Competencies

• Strong data analysis, problem‑solving, and critical thinking skills.
• Good communication and collaboration skills, with the ability to work effectively with cross‑functional teams.
• Good planning, organization, and follow‑up skills.
• Ability to work under pressure and demonstrate strong commitment to achieving production and quality goals.
• Proficiency in Microsoft PowerPoint, Excel, and Word.
• Knowledge of statistical and quality tools such as SPC and MSA is preferred.

Ideal Candidate Profile

• A proactive team player who is hands‑on, detail‑oriented, and comfortable working in a dynamic manufacturing environment.

Equal Opportunity Employer

Qualcomm is an equal opportunity employer. Individuals with disabilities may request reasonable accommodations during the hiring process.