Senior Process Engineer - Advanced Semiconductor Packaging

Kulicke & Soffa

Singapore

On-site

SGD 70,000 - 110,000

Full time

5 days ago
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Job summary

Kulicke & Soffa in Singapore seeks a Process Engineer to join a multidisciplinary team, developing and supporting high-precision semiconductor assembly and packaging equipment.

You will act as the key interface between customer and engineering, delivering turnkey solutions by maximizing machine capability, with emphasis on process optimization, data analysis, and collaboration across functions.

Qualifications

  • PhD/Master/Bachelor's Degree in Engineering field (Mechanical, Electrical, Mechatronics) or Physical science with 5-10 years of working experience.
  • Strong aptitude and deep understanding of highly advanced machinery.
  • Experience with flip chip, die attach or thermocompression bonding highly preferred.
  • Strong data analysis skills, including working knowledge of Matlab and/or JMP, Minitab;
  • Ability to travel locally and internationally about 50%, sometime more frequently.

Responsibilities

  • Test, troubleshoot and optimize processes on highly advanced semiconductor packaging equipment.
  • Identify areas for technical improvement and gaps in performance.
  • Identifies, analyzes and resolves system design weaknesses.
  • Conduct machine buy-offs in K&S factory and, at times, at customer site.
  • Analyze machine and process data to identify causes of process assists, failures or yield loss.
  • Serve as technical interface to customers.
  • Preparation of internal summary reports and customer presentations.
  • Provides multi-layered technical expertise for next generation initiatives.
  • Interfaces with other functional groups for troubleshooting and equipment improvement.

Skills

Machinery knowledge
Data analysis (Matlab/JMP/Minitab)
Travel willingness

Education

PhD/Master/Bachelor's in Engineering or Physical Science

Job description

Kulicke & Soffa in Singapore seeks a Process Engineer to join a multidisciplinary team, developing and supporting high-precision semiconductor assembly and packaging equipment.

You will act as the key interface between customer and engineering, delivering turnkey solutions by maximizing machine capability, with emphasis on process optimization, data analysis, and collaboration across functions.

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