Next-Gen Memory Packaging Architect

Micron Technology, Inc; Singapore; On-site; SGD 150,000 - 230,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking a Package Pathfinding Architect to define next‑generation packaging for memory systems, from datacenter to edge‑AI, collaborating across silicon, package, board and system domains to drive scalable products.

You will interface with customers and internal teams to shape long‑term roadmaps, applying AI and EDA tools to improve design cycles, with emphasis on speed, power, and reliability. The role demands deep memory timing knowledge and leadership.

Qualifications

• Master’s degree or equivalent in EE, CE, CS, or related field.
• At least 5 years of relevant industry experience in package design, electrical simulations and tools like Ansys, Siemens and Cadence.
• Extensive hands‑on experience in memory systems package design, signaling, IO design, PDN design.
• Deep understanding of memory timing, signaling, power, package process technology.
• Working knowledge of EDA tools for design, analysis and simulation of electronic packaging, including Cadence, Siemens and Ansys tools.
• Experience applying AI or LLMs for engineering efficiency.

Responsibilities

• Define next‑generation package pathfinding and system architectures optimizing for speed performance, system bandwidth, power, capacity, thermal, mechanical and electrical performance.
• Lead cross‑stack co‑optimization across silicon, package, board, and system with package centric solutions approach
• Drive long‑term memory technology packaging strategy and influence industry standards
• Work closely with silicon, and system design teams and customers for next generation and long term disruptive solutions to boost speed performance for edge‑AI and datacenter memory products
• Serve as a technical interface to internal partners, customers, BUs, senior leaders.
• Develop AI based EDA and internal automation tool sets for enhancing design cycle efficiency.
• Develop measurement automation for incoming substrate materials

Skills

Memory timing

Data‑driven engineering

AI/LLMs for engineering

Cross‑functional collaboration

Education

Master’s degree or equivalent in EE/CE/CS

Tools

Cadence

Ansys

Siemens

MATLAB

Python

Job description

Micron Technology, Inc. in Singapore is seeking a Package Pathfinding Architect to define next‑generation packaging for memory systems, from datacenter to edge‑AI, collaborating across silicon, package, board and system domains to drive scalable products.

You will interface with customers and internal teams to shape long‑term roadmaps, applying AI and EDA tools to improve design cycles, with emphasis on speed, power, and reliability. The role demands deep memory timing knowledge and leadership.