Advanced Packaging Engineer: 2.5D/3DIC

United Microelectronics Corporation (UMC); Singapore; On-site; SGD 80,000 - 130,000; Full time

Job summary

United Microelectronics Corporation (UMC) in Singapore is seeking an OSAT & Advanced Packaging Engineer to drive development of 2.5D/3D packaging platforms, ensuring quality and timely delivery through cross-functional teamwork. You will develop chip-to-wafer stacking, organic interposer, and interconnect processes, collaborating with R&D and OSAT partners to advance heterogeneous integration.

The role requires strong technical knowledge and hands-on verification of new packaging processes, with

Qualifications

• Bachelor's degree in electronics/electrical/physics/materials or related field.
• At least 3 years in advanced packaging OSAT R&D/integration/process engineering or related.
• Proficient English in speaking and writing.

Responsibilities

• Work on 2.5D/3D Advanced packaging platform technologies.
• Develop chip-to-wafer stacking, wafer-to-wafer 2.5/3D stacking, organic interposer, bumping, RDL, and interconnect.
• Collaborate with internal R&D and OSAT partners to drive heterogeneous integration.
• New advanced packaging process verification and qualification.
• Customer engagement and new product verification.

Skills

FMEA

DOE

Problem solving

Communication

Education

Bachelor's degree in Electronics/Electrical/Physics/Materials Engineering

Job description

United Microelectronics Corporation (UMC) in Singapore is seeking an OSAT & Advanced Packaging Engineer to drive development of 2.5D/3D packaging platforms, ensuring quality and timely delivery through cross-functional teamwork. You will develop chip-to-wafer stacking, organic interposer, and interconnect processes, collaborating with R&D and OSAT partners to advance heterogeneous integration.

The role requires strong technical knowledge and hands-on verification of new packaging processes, with