Senior Advanced Packaging Engineer for 5nm/3nm Nodes

SwiftCruit

Singapore

On-site

SGD 120,000 - 180,000

Full time

14 days+

Application generator

Don’t send a generic resume — generate a resume and cover letter tailored to this exact role.

Get past ATS filters

Job summary

Broadcom is seeking a senior IC packaging professional to lead development for next‑generation silicon node packages in Singapore. You will collaborate with IC design, system, and thermal teams to define substrate solutions, BOMs and manufacturing plans, ensuring performance and reliability.

The role requires deep CPI/SI/PI knowledge, Cadence APD proficiency, and hands‑on experience with flip‑chip, MCMs and 2.5D/3DIC concepts.

Qualifications

BS/MS/PhD in STEM or closely related engineering field.
Experience with IC packaging and advanced node programs is preferred.
Strong understanding of signal integrity and power integrity concepts.
Experience with Cadence APD for substrate design.
Ability to read mechanical drawings (GD&T) and work with cross-functional teams.

Responsibilities

Design custom packages with IC design, system design, package SI/PI & thermal teams.
Ensure packages meet CPI, SI/PI and thermal requirements for advanced node silicon products.
Manage IC packaging from concept through high volume production.
Define assembly BOM, process, troubleshoot packaging issues, support new technology adoption.
Productize newly developed technologies into high volume manufacturing (HVM).
Create package design documentation and assembly instructions.
Interface with QA and customers to resolve quality issues; coordinate with suppliers for qualification and ramp.
Support NPI bring-up, package qualification, and sustainment in production and multi-source activities.