Senior Packaging Design Engineer — 2.5D/3D, AI-Driven

advanced micro devices (singapore) pte ltd; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Advanced Micro Devices (Singapore) Pte Ltd is seeking an SMTS Package Design Engineer to lead end-to-end substrate design for complex 2.5D/3D packages, using AI-driven design techniques and automation to improve speed, quality and scalability.

The successful candidate will own multiple programs, collaborate with SI/PI, mechanical, and SOC teams, mentor junior engineers, and work with OSATs and substrate vendors to deliver optimized packaging solutions.

Qualifications

• Bachelor's degree or higher in Electrical/Computer Engineering or related field.
• Experience in substrate design or interposers.
• Proficiency with EDA tools Cadence SIP/APD and Synopsys 3DICC.
• Experience with OSATs, foundries, and substrate vendors.

Responsibilities

• Lead end-to-end package design execution for complex products, ensuring performance, cost, quality, and schedule targets are met.
• Handle multiple concurrent design programs in a fast-paced, high-pressure environment.
• Develop substrate layouts, bump maps, and interposer designs for 2.5D/3D packaging.
• Drive design decisions with SI/PI, mechanical, and SOC teams.

Skills

Ownership

Fast-paced execution

AI/ML in design

Automation in design

Cross-functional collaboration

Communication skills

Education

Bachelor’s degree or higher in Electrical Engineering, Computer Engineering, or related field

Tools

Cadence SIP/APD

Synopsys 3DICC

Job description

Advanced Micro Devices (Singapore) Pte Ltd is seeking an SMTS Package Design Engineer to lead end-to-end substrate design for complex 2.5D/3D packages, using AI-driven design techniques and automation to improve speed, quality and scalability.

The successful candidate will own multiple programs, collaborate with SI/PI, mechanical, and SOC teams, mentor junior engineers, and work with OSATs and substrate vendors to deliver optimized packaging solutions.