Packaging Process Engineer - 2.5D/3D IC Packaging

ByteDance; Singapore; On-site; SGD 90,000 - 140,000; Full time

Job summary

ByteDance's Silicon Platform Team is seeking a Packaging Engineer to drive 2D/2.5D/3D packaging process integration and support mass production. You will collaborate with front-end chip teams to optimize design rules and solve packaging challenges across FCBGA, FCCSP, and MCM technologies.

The role requires a Master’s degree in a related field and hands-on experience in advanced packaging, with strong cross‑team communication and problem‑solving abilities.

Qualifications

• Master’s degree or above in Microelectronics, Electronics, Materials Science, Mechanical Engineering, or related field.
• At least 2 years of relevant work experience in packaging.
• Experience in 2D/2.5D/3D packaging processes.
• Familiar with packaging process flow and DRM.

Responsibilities

• Interface with OSATs, fabs, and substrate vendors to resolve packaging issues.
• Follow up with suppliers to meet process requirements and ensure smooth production flow.
• Lead process research and pre-verification of new packaging technologies.
• Coordinate with packaging design, thermal/stress simulation, and product teams to resolve cross-domain issues.

Job description

ByteDance's Silicon Platform Team is seeking a Packaging Engineer to drive 2D/2.5D/3D packaging process integration and support mass production. You will collaborate with front-end chip teams to optimize design rules and solve packaging challenges across FCBGA, FCCSP, and MCM technologies.

The role requires a Master’s degree in a related field and hands-on experience in advanced packaging, with strong cross‑team communication and problem‑solving abilities.