Senior Underfill Process Engineer – Advanced Packaging

UTAC; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

UTAC in Singapore is seeking an Underfill Process Development Engineer responsible for developing, optimizing, qualifying, and sustaining underfill processes for advanced semiconductor packaging technologies. You will work with customers, suppliers, and manufacturing teams to deliver robust underfill solutions meeting quality, reliability, and productivity requirements.

3–10 years in packaging process development is preferred.

Qualifications

• 3–10 years of semiconductor packaging process development experience.
• Experience in underfill process development preferred.
• Experience in advanced packaging technologies is highly desirable.

Responsibilities

• Develop and optimize capillary underfill and advanced dispensing processes for semiconductor packages.
• Establish process windows for underfill dispense, flow, cure, and post-cure operations.
• Evaluate new underfill materials and dispensing technologies.
• Define and execute DOE to improve process capability and performance.
• Develop processes for advanced packaging applications including Flip Chip, 2.5D, and SiP technologies.

Skills

Underfill dispensing

Curing processes

DOE

Process characterization

Root cause analysis

Yield improvement

SPC

FMEA

Failure analysis

Education

Bachelor's Degree in Chemical Engineering

Bachelor's Degree in Materials Science Engineering

Bachelor's Degree in Mechanical Engineering

Bachelor's Degree in Electronics Engineering

Bachelor's Degree in Semiconductor Engineering

Master's Degree preferred

Tools

Asymtek

NSW

Job description

UTAC in Singapore is seeking an Underfill Process Development Engineer responsible for developing, optimizing, qualifying, and sustaining underfill processes for advanced semiconductor packaging technologies. You will work with customers, suppliers, and manufacturing teams to deliver robust underfill solutions meeting quality, reliability, and productivity requirements.

3–10 years in packaging process development is preferred.