IC Packaging Engineer II — R&D & Manufacturing Excellence

Microchip; Philippines; On-site; PHP 600,000 - 1,000,000; Full time

Job summary

Microchip Technology in the Philippines seeks a Panel Level Package Development Engineer to lead R&D activities for new materials, processes, and packaging technologies. You will drive design reviews, process characterization and validation to enable reliable production.

The role partners with manufacturing and quality teams to support MES configuration, lot kitting, wafer verification and lot release for smooth production of advanced IC products.

Qualifications

• At least 5 years of IC packaging engineering experience.
• Exposure to high-volume IC assembly/production is preferred.
• Strong collaboration with cross-functional teams to support NPI and production excellence.

Responsibilities

• Lead R&D activities for new materials, processes, and packaging tech.
• Coordinate MES configuration, lot kitting, wafer verification and lot release.
• Conduct design reviews, process characterization and risk assessments.
• Support new product introductions and continuous improvement initiatives.

Skills

IC packaging engineering

High-volume IC assembly

Education

Diploma in Electronics/Electrical/Mechatronics/Industrial Tech or related Engineering Degree

Job description

Microchip Technology in the Philippines seeks a Panel Level Package Development Engineer to lead R&D activities for new materials, processes, and packaging technologies. You will drive design reviews, process characterization and validation to enable reliable production.

The role partners with manufacturing and quality teams to support MES configuration, lot kitting, wafer verification and lot release for smooth production of advanced IC products.