Senior Process Engineer I - Die Attach & Packaging

Microchip Technology Inc.; Laguna; On-site; PHP 600,000 - 900,000; Full time

Job summary

Microchip Technology Inc. in the Philippines is seeking an experienced manufacturing/engineering professional to join its Laguna team.

This role centers on advanced packaging and reliability, including QFN-DP knowledge and processes like Die Attach, Tape and Reel, Backgrind and Saw. Candidates should hold an engineering degree, have at least five years in related fields, and show strong communication, teamwork, and problem-solving skills.

Qualifications

• Graduate of any engineering course.
• Minimum 5-year experience in related field.
• Good communication skill and team player.
• Experience in Die Attach, Tape and Reel, Backgrind and Saw process.
• Knowledgeable in DOE, SPC, engineering tools, FMEA and control plan.
• Background in material science and reliability is advantageous.
• Prefer project management experience.

Skills

QFN-DP package

Die Attach

Tape and Reel

Backgrind

Saw process

DOE

SPC

FMEA

Control plans

Line sustaining

Engineering analysis

Decision making

Communication skills

Team player

Project management

Education

Bachelor's degree in engineering

Job description

Microchip Technology Inc. in the Philippines is seeking an experienced manufacturing/engineering professional to join its Laguna team.

This role centers on advanced packaging and reliability, including QFN-DP knowledge and processes like Die Attach, Tape and Reel, Backgrind and Saw. Candidates should hold an engineering degree, have at least five years in related fields, and show strong communication, teamwork, and problem-solving skills.