Engineer Ii-Packaging

Microchip; Philippines; On-site; PHP 600,000 - 1,000,000; Full time

Job summary

Microchip Technology in the Philippines seeks a Panel Level Package Development Engineer to lead R&D activities for new materials, processes, and packaging technologies. You will drive design reviews, process characterization and validation to enable reliable production.

The role partners with manufacturing and quality teams to support MES configuration, lot kitting, wafer verification and lot release for smooth production of advanced IC products.

Qualifications

• At least 5 years of IC packaging engineering experience.
• Exposure to high-volume IC assembly/production is preferred.
• Strong collaboration with cross-functional teams to support NPI and production excellence.

Responsibilities

• Lead R&D activities for new materials, processes, and packaging tech.
• Coordinate MES configuration, lot kitting, wafer verification and lot release.
• Conduct design reviews, process characterization and risk assessments.
• Support new product introductions and continuous improvement initiatives.

Skills

IC packaging engineering

High-volume IC assembly

Education

Diploma in Electronics/Electrical/Mechatronics/Industrial Tech or related Engineering Degree

Job description

Job Description

Panel Level Package Development Engineer

Responsible for leading R&D activities focused on the development, qualification and deployment of new materials, processes, products and manufacturing technologies to support business and technology roadmap objectives. The role drives technical evaluations, design reviews, process characterization, risk assessments and validation activities to ensure successful implementation of development projects. In addition, position supports MES configuration, lot kitting, wafer verification and lot release activities to ensure accurate product setup and smooth production execution. The position works closely with cross-functional teams to support new product introduction, continuous improvement and operation excellence.

Requirements/Qualifications

Education

Minimum diploma in Electronics Engineering, Electrical Engineering, Mechatronics, Industrial Technology, or related field (Engineering Degree)

Work Experience

• At least 5 years of IC packaging engineering experience
• Prior exposure and work in a high-volume IC assemble production/factory is preferred

Travel Time

0% - 25%

About the Company

Microchip Technology is a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions that also offers outstanding technical support.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values ; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence.