Senior Package Process Engineer - Die & Packaging Innovation

onsemi; Carmona; On-site; PHP 1,800,000 - 3,200,000; Full time

Job summary

onsemi in Cavite, Philippines seeks a senior R&D Packaging Engineer to lead die preparation initiatives and advanced packaging development. You will partner with multiple teams to drive innovation, design experiments, and refine processes for scalable production.

The role requires 8+ years in semiconductor package assembly process development, strong analytical skills, and proven collaboration abilities. Project management experience is a plus and mentorship is expected.

Qualifications

• Bachelor's or Master's in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
• 8+ years in semiconductor package assembly process development.
• Experience with project management is a plus.
• Strong analytical and problem-solving skills.

Responsibilities

• Lead R&D initiatives focused on die preparation processes and related technologies.
• Collaborate with cross-functional teams to drive innovation and integrate new process technologies.
• Design and conduct experiments to develop and refine packaging processes.
• Analyze experimental data to identify trends and optimize process parameters.
• Develop comprehensive process documentation and control plans.
• Address and resolve complex process-related challenges.
• Stay abreast of advancements in semiconductor packaging and apply cutting-edge techniques.
• Mentor and provide technical leadership to junior engineers and team members.
• Ensure all R&D activities comply with industry standards and company policies.

Skills

Wafer singulation

Packaging technologies

Process development

Analytical skills

Communication

Project management tools

Education

Bachelor's or Master's in Electrical/Materials/Mechanical Eng

Tools

Project management tools

Job description

onsemi in Cavite, Philippines seeks a senior R&D Packaging Engineer to lead die preparation initiatives and advanced packaging development. You will partner with multiple teams to drive innovation, design experiments, and refine processes for scalable production.

The role requires 8+ years in semiconductor package assembly process development, strong analytical skills, and proven collaboration abilities. Project management experience is a plus and mentorship is expected.