R&D Development Manager

Microchip; Philippines; On-site; PHP 1,500,000 - 2,100,000; Full time

Job summary

Microchip Technology Inc. is seeking an experienced R&D Development Manager to lead panel-level package development in its Philippines facility. The role covers R&D and NPI engineering management, working with cross-functional teams to deliver advanced packaging solutions.

You will supervise engineers, drive process improvements, and ensure successful qualification of new package technologies in a high-volume environment. Excellent leadership and global collaboration are required.

Qualifications

• BS degree in Electrical, Material, Mechanical engineering or other equivalent engineering field.

Responsibilities

• Oversee R&D and NPI packaging projects.
• Drive package development and optimization for high-volume IC assembly.
• Coordinate with manufacturing for scale-up and production readiness.

Skills

IC packaging

WLCSP

Stacked Die

Laminate packages

Lead frame

High-volume fab

CAD software

AutoCAD

Cadence APD

FEA modeling

Thermal optimization

Mechanical optimization

Cu pillar bump

SiP packaging

Cu Clip assembly

Strip-testable packaging

Education

B.S. in Electrical/Materials/Mechanical engineering

Equivalent engineering field

Tools

AutoCAD

Cadence APD

Job description

Job Description - R&D Development Manager

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values ; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.

Job Description:

This position is for an R&D and NPI engineering manager to support Panel Level Package development in Microchip's Philippine factory

Requirements/Qualifications:

Education

BS degree in Electrical, Material, Mechanical engineering or other equivalent engineering field

Work Experience:

• At least 8 years of direct or managed IC packaging engineering experience including advanced pkg development (WLCSP, stacked die, laminate and lead frame packages)
• Prior exposure and work in a high-volume IC assembly production/factory is preferred

Preferred Skills

• CAD software use (e.g. AutoCAD and Cadence APD)
• FEA modeling experience for thermal, mechanical and electrical package optimization
• Advanced package development knowledge including WLCSP, Cu pillar bump, SiP packaging, and Cu Clip assembly
• Experience in strip-testable package development

Travel Time:

0% - 25%

To all recruitment agencies: Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes.

About the Company

Microchip Technology is a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions that also offers outstanding technical support.