Lead R&D Packaging & NPI Engineering Manager

Microchip; Philippines; On-site; PHP 1,500,000 - 2,100,000; Full time

Job summary

Microchip Technology Inc. is seeking an experienced R&D Development Manager to lead panel-level package development in its Philippines facility. The role covers R&D and NPI engineering management, working with cross-functional teams to deliver advanced packaging solutions.

You will supervise engineers, drive process improvements, and ensure successful qualification of new package technologies in a high-volume environment. Excellent leadership and global collaboration are required.

Qualifications

• BS degree in Electrical, Material, Mechanical engineering or other equivalent engineering field.

Responsibilities

• Oversee R&D and NPI packaging projects.
• Drive package development and optimization for high-volume IC assembly.
• Coordinate with manufacturing for scale-up and production readiness.

Skills

IC packaging

WLCSP

Stacked Die

Laminate packages

Lead frame

High-volume fab

CAD software

AutoCAD

Cadence APD

FEA modeling

Thermal optimization

Mechanical optimization

Cu pillar bump

SiP packaging

Cu Clip assembly

Strip-testable packaging

Education

B.S. in Electrical/Materials/Mechanical engineering

Equivalent engineering field

Tools

AutoCAD

Cadence APD

Job description

Microchip Technology Inc. is seeking an experienced R&D Development Manager to lead panel-level package development in its Philippines facility. The role covers R&D and NPI engineering management, working with cross-functional teams to deliver advanced packaging solutions.

You will supervise engineers, drive process improvements, and ensure successful qualification of new package technologies in a high-volume environment. Excellent leadership and global collaboration are required.