Process Engineer - Semiconductor Packaging & DOE

Microchip Technology Inc.; Philippines; On-site; PHP 600,000 - 1,200,000; Full time

Job summary

Microchip Technology Inc. in the Philippines is seeking a skilled engineer to support packaging and manufacturing processes for QFN-DP devices. You will apply knowledge of Die Attach, Tape and Reel, Backgrind and Saw processes to maintain quality and yield.

The role requires strong analytical thinking, familiarity with DOE, SPC, FMEA and control plans, and the ability to work well with cross-functional teams. Travel may be 0-25%.

Qualifications

• Graduate of any engineering course.
• Minimum 5-year experience in related field.
• Good communication skill and team player.

Responsibilities

• Work on QFN-DP packaging processes and die attach.
• Experience with Die Attach, Tape and Reel, Backgrind and Saw processes.
• Apply DOE, SPC, FMEA and control plans in projects.
• Perform line sustaining and engineering analysis.
• Communicate effectively and work as a team player.

Skills

QFN-DP package knowledge

Die Attach experience

Tape and Reel experience

Backgrind experience

DOE

SPC

FMEA

Control plan

Engineering tools

Line sustaining

Strong communication

Team player

Project management

Education

Engineering degree

Tools

DOE

SPC

FMEA

Control plan

Job description

Microchip Technology Inc. in the Philippines is seeking a skilled engineer to support packaging and manufacturing processes for QFN-DP devices. You will apply knowledge of Die Attach, Tape and Reel, Backgrind and Saw processes to maintain quality and yield.

The role requires strong analytical thinking, familiarity with DOE, SPC, FMEA and control plans, and the ability to work well with cross-functional teams. Travel may be 0-25%.