Senior Process Engineer – Die Attach & Packaging

Microchip Technology Operations Philippines Inc; Philippines; On-site; PHP 600,000 - 1,000,000; Full time

Job summary

Microchip Technology Inc. Philippines is seeking an experienced senior engineer to support QFN-DP packaging and related die attach, tape and reel, and backgrind processes. The role focuses on sustaining production, solving engineering problems, and driving continuous improvement.

The successful candidate will have at least five years in semiconductor manufacturing, strong analytical skills, and good communication. An engineering degree is required; project management experience is a plus.

Qualifications

• Graduate of any engineering course.
• Minimum 5-year experience in related field.
• Good communication skill and team player.

Responsibilities

• Knowledgeable in QFN-DP package.
• With experience in Die Attach, Tape and Reel, Backgrind and Saw process
• Knowledgeable in DOE, SPC, engineering tools, FMEA and control plan
• With experience in line sustaining.
• With strong engineering analysis and decision making.
• Good communication skills and team player.
• Background in material science and reliability is advantage.
• Preferred with project management experience.

Skills

QFN-DP package

Die Attach

Tape and Reel

Backgrind

Saw process

DOE

SPC

FMEA

Control plan

Line sustaining

Engineering analysis

Decision making

Communication

Team player

Materials science

Reliability

Project management

Education

Engineering degree

Job description

Microchip Technology Inc. Philippines is seeking an experienced senior engineer to support QFN-DP packaging and related die attach, tape and reel, and backgrind processes. The role focuses on sustaining production, solving engineering problems, and driving continuous improvement.

The successful candidate will have at least five years in semiconductor manufacturing, strong analytical skills, and good communication. An engineering degree is required; project management experience is a plus.