Die Prep Process Engineer (MES Project)

118-WW TMG MFG OPS; Kuala Lumpur; On-site; MYR 90,000 - 130,000; Full time

Job summary

Texas Instruments in Malaysia is seeking a Process Engineer to lead the digital design of our Die Prep manufacturing processes. This multi-phase role begins with a 1 month TI orientation, then deployment into a critical MES implementation project for 1–2 years, after which you return to production to optimize yield using MES data.

You will drive Die Prep process design within MES, define flows, routing, and material handling, and establish digital process controls and exception handling.

Qualifications

• Bachelor's degree in a relevant engineering/physics field.
• Minimum 2 years of semiconductor process experience in Die Prep.
• Strong foundation in SPC, engineering change control and process release strategies.

Responsibilities

• MES Implementation: Drive Die Prep process design within the MES.
• Control & Exception Handling: Define digital process controls and exception handling.
• Alignment & Validation: Validate workflows with quality and manufacturing teams; support UAT and deployment.
• Sustaining: Return to production to utilize MES data for process optimization, yield analysis.

Skills

Statistical process control

Engineering change control

Process release strategies

Team collaboration

Problem solving

Communication skills

Education

Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field

Tools

MES

Quality systems

Job description

Change the world. Love your job.
Texas Instruments is seeking a Process Engineer to lead the digital design of our Die Prep manufacturing processes. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1–2 years. Once the system is live, you will return to a production role, using your knowledge of digital process controls to drive yield and efficiency.

Key Responsibilities:

• MES Implementation (Project Phase): Drive Die Prep process design within the MES. Define flows, routing, and material handling.
• Control & Exception Handling: Define digital process controls and exception handling (holds/rework) specific to Die Prep/Dicing operations.
• Alignment & Validation: Validate workflows with quality and manufacturing teams; support UAT and deployment.
• Sustaining (Post-Project Phase): Return to production to utilize MES data for process optimization, yield analysis, and managing Die Prep process stability.

Minimum requirements:

• Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field
• Strong hands-on semiconductor process experience in Die Prep, with minimum 2 years of relevant experience
• Strong foundation in statistical process control, engineering change control and process release strategies

Preferred qualifications:

• Working knowledge of MES, quality systems, or manufacturing execution platforms.
• Equip with backgrind, dicing process, mechanical saw & laser saw process experiences are welcome
• Demonstrated strong analytical and problem solving skills
• Strong verbal and written communication skills
• Ability to work in teams and collaborate effectively with people in different functions
• Strong time management skills that enable on-time project delivery
• Demonstrated ability to build strong, influential relationships
• Ability to work effectively in a fast-paced and rapidly changing environment
• Ability to take the initiative and drive for result