Senior Process Engineer: Die Attach & Wire Bond

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd; Bayan Lepas; On-site; MYR 90,000 - 120,000; Full time

Job summary

OSRAM OS Penang is seeking a Process Development Senior Engineer focused on Die Attach and Wire Bond to drive development for new products in Bayan Lepas, Malaysia. You will lead process optimization, select suitable equipment, and work with R&D and Manufacturing teams to meet cost, quality, and schedule goals.

The ideal candidate holds a degree in Electrical/ Electronics/ Mechatronics / Mechanical Engineering, with 2–3 years in semiconductor Die Attach and Wire Bond, and knowledge of statistics

Qualifications

• Degree or Master in Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent.
• 2-3 years in semiconductor field especially in Die Attach and Wire Bond processes.
• Process engineering knowledge in semiconductors or LED manufacturing processes.
• Knowledge in process development steps and statistics.
• Minitab knowledge will be advantage.
• Six Sigma Green or Black Belt will be advantage.

Responsibilities

• Develop or optimize Die Attach and Wire Bond processes for new product development project to meet project cost, quality and timeline targets.
• Participate and support FOL processes tehcnology roadmap and building block activities.
• Equipment selection which meet project cost, quality and timeline target.
• Share and transfer technical know how within R&D and to Manufacturing team.
• Provide technical guidance or job coaching to junior supporting staff
• Participate in engineering sample, pre-series and ramp-up build to fulfill customer order.

Skills

Die Attach

Wire Bond

Process Engineering

Statistical Analysis

Minitab

Six Sigma Green/Black Belt

Education

Bachelor's or Master's in Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent

Tools

Minitab

Job description

OSRAM OS Penang is seeking a Process Development Senior Engineer focused on Die Attach and Wire Bond to drive development for new products in Bayan Lepas, Malaysia. You will lead process optimization, select suitable equipment, and work with R&D and Manufacturing teams to meet cost, quality, and schedule goals.

The ideal candidate holds a degree in Electrical/ Electronics/ Mechatronics / Mechanical Engineering, with 2–3 years in semiconductor Die Attach and Wire Bond, and knowledge of statistics