Process Development Engineer II - Wire Bond & Yield

Analog Devices, Inc.; Penang; On-site; MYR 67,000 - 134,000; Full time

Job summary

Analog Devices, Inc. is seeking an Engineer II in Penang to develop, setup and operate DA or wire bond processes. The role involves establishing new machine recipes, implementing tool/jig changes, and driving yield and robustness improvements across new product introductions.

The candidate will document procedures (ROHS, FMEA, control plans) and provide training to engineers, technicians, operators, and trainers while coordinating DOE evaluations to closure.

Qualifications

• Experience in semiconductor process development and related DOE studies.
• Ability to design and optimize wire bond processes and recipes.
• Track record of improving yield and process robustness.

Responsibilities

• Develop, setup and operate DA or wire bond (Cu/Au) wire process.
• Establish new machine recipes with suitable parameters.
• Modify machines/tools/jigs to improve yield and robustness.
• Work on yield improvement initiatives and process optimization.
• Coordinate engineering/DOE evaluations and follow up to closure.
• Document procedures, ROHS, FMEA and control plans.
• Provide training to engineers, technicians and operators.
• Recommend materials and process flows for new products.
• Resolve process issues using systematic analysis tools.

Skills

Process development

DOE evaluations

Yield improvement

Training

Tools

Wire bonding equipment

Process tooling

Job description

Analog Devices, Inc. is seeking an Engineer II in Penang to develop, setup and operate DA or wire bond processes. The role involves establishing new machine recipes, implementing tool/jig changes, and driving yield and robustness improvements across new product introductions.

The candidate will document procedures (ROHS, FMEA, control plans) and provide training to engineers, technicians, operators, and trainers while coordinating DOE evaluations to closure.