Process Development Engineer II - Wire Bond & Yield

1326 Analog Devices Manufacturing (Malaysia) Sdn. Bhd.; Penang; On-site; MYR 36,000 - 72,000; Full time

Job summary

Analog Devices, Inc. inPenang, Malaysia is seeking a manufacturing technician to develop, set up and operate DA or wire bond processes. You will establish machine recipes and parameters for DA or wire bonder, and contribute to yield improvements and process robustness.

The role involves coordinating DOE evaluations, maintaining documentation (OPs, ROHS, FMEA, control plans) and delivering training to engineers, technicians, operators, and trainers. A travel clause may apply as needed.

Responsibilities

• To develop, setup and operate DA or wire bond (Cu/Au) wire process.
• To establish new machine recipe with suitable machine and process parameters on DA or wire bonder.
• To work on machine modifications/tools/jigs fabrication for yield improvement or enhance Process robustness.
• To work on yield improvement.
• To coordinate engineering/DOE evaluations build and follow up closely until closure.
• To work on documentation such as operating procedures, ROHS, FMEA, control plan etc.
• To provide training to all parties such as engineers, technicians, operators, and trainer.
• To recommend the best material & process flow for all the new product introduction.
• To solve process issues in systematic way by correct analysis tools.

Job description

Analog Devices, Inc. inPenang, Malaysia is seeking a manufacturing technician to develop, set up and operate DA or wire bond processes. You will establish machine recipes and parameters for DA or wire bonder, and contribute to yield improvements and process robustness.

The role involves coordinating DOE evaluations, maintaining documentation (OPs, ROHS, FMEA, control plans) and delivering training to engineers, technicians, operators, and trainers. A travel clause may apply as needed.