Process Development Engineer (Wire Bond)

Mini-Circuits Technologies (Malaysia) Sdn Bhd

Penang

On-site

MYR 60,000 - 90,000

Full time

6 days ago
Be an early applicant
Application generator

Get a reply from this employer — a resume and cover letter tailored to exactly what they’re hiring for.

Get past ATS filters

Job summary

Mini-Circuits Technologies (Malaysia) Sdn Bhd is seeking a Process Development Engineer (Wire Bond) to sustain and optimize wire bond processes in production and NPI. You will drive process improvements, apply FMEA, and implement SPC to ensure quality and efficiency.

The role requires a Diploma or Bachelor’s degree with 2–3 years of wire bond experience and familiarity with related software such as AutoCad. Collaboration with equipment teams and mentoring of junior staff are key parts of the job.

Qualifications

  • Bachelor’s degree or Diploma in Manufacturing, Engineering or Applied Science, or equivalent.
  • 2–3 years of experience preferred, with wire bond exposure.
  • Related software knowledge such as AutoCad is a plus.

Responsibilities

  • Provide process sustenance and improvements for wire bond in production and NPI development.
  • Apply FMEA to assess risks and implement effective process controls.
  • Use SPC tools to monitor and improve processes.
  • Document processes, procedures and methods as required.
  • Train operators and technicians as required.
  • Develop, qualify and monitor new process buyoffs.
  • Collaborate with equipment team to design fixtures for assembly and test processes.
  • Coach associate engineers and technicians in daily routines.

Skills

Wire Bond experience
Manufacturing know-how

Education

Bachelor’s degree or Diploma in Manufacturing/Engineering/Applied Science

Tools

AutoCad

Job description

Process Development Engineer (Wire Bond)

To provide process sustenance and improvement for wire bond in production, die sales and NPI process development.

Duties/Job Responsibilities:

Employ quantitative problem solving and corrective action methods.

Apply FMEA tools to develop risks assessment matrix to develop effective process control with simplify procedures.

Implement and utilize statistical process control tools as required.

Make sound technical toward positive business recommendation.

Document processes, procedures, and methods as required.

Promote teamwork and cooperation among technicians and associate engineers.

Observe and ensure safety requirements.

Train operators and technicians as required.

Specify, select and qualify/buyoff assembly equipment.

Develop, qualify, improve and monitor/control new processes buyoff.

Work with equipment technical team to design fixtures for assembly and test processes as required.

Select, evaluate, and qualify new materials, designs and processes as required.

Coach and guide associate engineer and technician in their daily routines and activities.

Initiate product yield improvement projects.

Understanding of basic Failure Analysis

Manufacturing cycle time improvement.

Any other job responsibilities assigned by the supervisor as and when required.

Qualifications/Requirements:

Bachelor’s Degree or its equivalent in relevant fields of Manufacturing, Engineering or Applied Science, or Diploma holder with minimum 2-3 years experience

Preferably with 2-3 years experience in wire bond experiences

Related software and AutoCad knowledge is an added advantage

Mini-Circuits makes the building blocks that shape the wireless world. From communications networks and critical national security systems to life-saving diagnostic imaging, quantum computing and much more, we support the world’s most innovative companies in building a faster, smarter, more connected future with the power of RF, microwave and millimeter wave technology.

In Penang, Mini-Circuits Technologies (Malaysia), a member company of Mini-Circuits operated back in 1999 with the brand new state-of-the-art facility on a 13-acres land. The facility in Penang focuses on Research and Development, Manufacturing, Logistics and serves as Worldwide MMIC Center of Excellence.

Mini-Circuits makes the building blocks that shape the wireless world. From communications networks and critical national security systems to life-saving diagnostic imaging, quantum computing and much more, we support the world’s most innovative companies in building a faster, smarter, more connected future with the power of RF, microwave and millimeter wave technology.

In Penang, Mini-Circuits Technologies (Malaysia), a member company of Mini-Circuits operated back in 1999 with the brand new state-of-the-art facility on a 13-acres land. The facility in Penang focuses on Research and Development, Manufacturing, Logistics and serves as Worldwide MMIC Center of Excellence.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Wire Bond Process Engineer — Yield & Innovation
Wire Bond Process Engineer — Yield & Innovation

Mini-Circuits Technologies (Malaysia) Sdn Bhd • Penang

On-site
MYR 60,000 - 90,000
Senior Wirebond Process/Equipment Engineer
Senior Wirebond Process/Equipment Engineer

118-WW TMG MFG OPS • Malacca City

On-site
MYR 90,000 - 130,000
Senior Wire Bond Process Engineer
Senior Wire Bond Process Engineer

Osram (Malaysia) Sdn Bhd • Penang

On-site
MYR 120,000 - 180,000
Senior Wirebond Equipment Engineer
Senior Wirebond Equipment Engineer

Texas Instruments Incorporated • Malacca City

On-site
MYR 90,000 - 150,000
Senior Wirebond Equipment Engineer
Senior Wirebond Equipment Engineer

Texas Instruments • Malacca City

On-site
MYR 120,000 - 180,000
Senior Wirebond Process/Equipment Engineer
Senior Wirebond Process/Equipment Engineer

Texas Instruments • Malacca City

On-site
MYR 180,000 - 240,000
Process Development Engineer II - Wire Bond & Yield
Process Development Engineer II - Wire Bond & Yield

1326 Analog Devices Manufacturing (Malaysia) Sdn. Bhd. • Penang

On-site
MYR 36,000 - 72,000
Senior Wire Bonding Engineer - Process Optimization
Senior Wire Bonding Engineer - Process Optimization

PCL INTERNATIONAL TECHNOLOGIES (PENANG) SDN. BHD. • Batu Kawan

On-site
MYR 120,000 - 180,000
Process Development Engineer II - Wire Bond & Yield
Process Development Engineer II - Wire Bond & Yield

Analog Devices, Inc. • Penang

On-site
MYR 67,000 - 134,000
Die/Wire Bond Process Engineer for Yield & Optimization
Die/Wire Bond Process Engineer for Yield & Optimization

Renesas Electronics • Bayan Lepas

On-site
MYR 78,000 - 134,000