Senior Principal Engineer, Wire Bond Equipment & Systems

Randstad Malaysia; Kuala Lumpur; On-site; MYR 300,000 - 520,000; Full time

Job summary

Global Leader in Semiconductor Solutions in Malaysia seeks a Principal Engineer for Equipment Engineering. You will be the technical authority on wire bond equipment, lead a high-performing team, and drive proactive maintenance strategies to maximize uptime and performance.

You will establish KPIs, govern hardware/software standards, and champion cost-efficient, safe operations while mentoring engineers and technicians across functions.

Qualifications

• Bachelor’s or Master’s degree in Mechanical, Electronics, Mechatronics, or Automation Engineering.
• Minimum of 8 years of engineering experience in the semiconductor industry, with wire bond expertise.
• Lean manufacturing and quality tools; experience with 8D and DMAIC methodologies.

Responsibilities

• Technical Leadership: lead and mentor a technical team in defining and executing planned maintenance strategies.
• Equipment Governance: act as end-to-end equipment governance owner from conceptualization to sustainment.
• Wire Bond Optimization: set KPIs, monitoring systems and drive improvements in wire bond equipment.
• New Machine Integration: leverage maintenance data to optimize new machinery and standardize protocols.
• Systematic Maintenance: design a maintenance framework for high availability, reliability and safety.
• Zero-Defect Drive: push for systematic improvements to eliminate breakdowns.
• Advanced Integration: enhance stability by integrating with APC tools and semi-automatic systems.
• Cost Efficiency: pursue equipment improvements to meet Total Cost Reduction targets.
• Talent Development: develop and certify engineers and technicians per competency models.

Skills

Leadership

Communication

Risk Management

Technical Acumen

Education

Bachelor’s or Master’s degree in Mechanical, Electronics, Mechatronics, or Automation Engineering

Tools

DMAIC

8D problem solving

Job description

Global Leader in Semiconductor Solutions in Malaysia seeks a Principal Engineer for Equipment Engineering. You will be the technical authority on wire bond equipment, lead a high-performing team, and drive proactive maintenance strategies to maximize uptime and performance.

You will establish KPIs, govern hardware/software standards, and champion cost-efficient, safe operations while mentoring engineers and technicians across functions.