Senior Wire Bond Equipment & Process Engineer

Texas Instruments

Malacca City

On-site

MYR 120,000 - 180,000

Full time

4 days ago

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Job summary

Texas Instruments Malaysia seeks an experienced Wire Bond Equipment Engineer to join a dynamic team focused on supporting semiconductor manufacturing. You will evaluate, select, and maintain wire bond equipment, ensuring high uptime and reliability for TI products.

You will collaborate with repair and process engineering teams to optimize processes and prevent downtime. The role requires a minimum of five years in wire bond equipment maintenance with KNS and ASM systems, with strong attention to

Qualifications

Bachelor degree in Electronics or Electrical engineering, Mechanical Engineering or related engineering degree.
Minimum 5 years as Wirebond Equipment Engineer with KNS and ASM wirebond equipment maintenance in semiconductor manufacturing operations.
Experience with wire bond processes and related equipment is highly advantageous.
Work arrangement: Full-time onsite role at Texas Instruments Malaysia, Batu Berendam, Malacca.

Responsibilities

Evaluating, selecting and ordering equipment for cost-effective manufacture of TI products.
Overseeing installation, modification, upgrade and maintenance of manufacturing equipment.
Staying current on manufacturers' technical notices, upgrades and safety issues.
Studying equipment performance and reliability; identifying uptime improvements.
Providing technical support within manufacturing equipment repair and process engineering teams.
Defining and writing preventative maintenance schedules.