Senior Wirebond Equipment Specialist

Texas Instruments Incorporated

Malacca City

On-site

MYR 90,000 - 150,000

Full time

7 days ago
Be an early applicant
Application generator

Turn this role into an interview — a resume and cover letter built around what this employer wants.

Get past ATS filters

Job summary

Texas Instruments Malaysia aims to hire a Senior Wirebond Process/Equipment Engineer to drive selection, installation, and maintenance of wire bond equipment at the Batu Berendam site. The role emphasizes equipment uptime, process support, and hands-on troubleshooting.

A bachelor’s in electronics/EE or related field with 5+ years’ experience is required, including KNS/ASM machine familiarity. Onsite, full-time position based in Melaka with exposure to wire bond processes and materials such as

Qualifications

  • Bachelor's degree in Electronics or Electrical Engineering or related field.
  • Minimum 5 years as Wirebond Equipment Engineer with KNS and ASM equipment maintenance in semiconductor manufacturing.
  • Hands-on experience with wire bond process advantageous.

Responsibilities

  • Evaluating, selecting, and ordering equipment for manufacturing."
  • Overseeing installation, modification, upgrade and maintenance of manufacturing equipment.
  • Studying equipment performance and reliability to increase uptime.
  • Providing technical support to manufacturing equipment repair and process engineering groups.
  • Defining and writing preventative maintenance schedules.

Skills

Wirebond process
Equipment maintenance
Analytical thinking
Team collaboration

Education

Bachelor's degree in Electronics or Electrical Engineering
Mechanical Engineering or related engineering degree

Tools

KNS wire bond machine
ASM wire bond machine

Job description

Texas Instruments Malaysia aims to hire a Senior Wirebond Process/Equipment Engineer to drive selection, installation, and maintenance of wire bond equipment at the Batu Berendam site. The role emphasizes equipment uptime, process support, and hands-on troubleshooting.

A bachelor’s in electronics/EE or related field with 5+ years’ experience is required, including KNS/ASM machine familiarity. Onsite, full-time position based in Melaka with exposure to wire bond processes and materials such as

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Senior Wirebond Equipment Engineer – Shape Semiconductors Onsite
Senior Wirebond Equipment Engineer – Shape Semiconductors Onsite

118-WW TMG MFG OPS • Malacca City

On-site
MYR 90,000 - 130,000
Senior Wire Bond Equipment & Process Engineer
Senior Wire Bond Equipment & Process Engineer

Texas Instruments • Malacca City

On-site
MYR 120,000 - 180,000
Senior Wirebond Equipment Engineer
Senior Wirebond Equipment Engineer

Texas Instruments Incorporated • Malacca City

On-site
MYR 90,000 - 150,000
Senior Wirebond Process/Equipment Engineer
Senior Wirebond Process/Equipment Engineer

118-WW TMG MFG OPS • Malacca City

On-site
MYR 90,000 - 130,000
Senior Wirebond Process/Equipment Engineer
Senior Wirebond Process/Equipment Engineer

Texas Instruments • Malacca City

On-site
MYR 120,000 - 180,000
Senior Principal Engineer, Wire Bond Equipment & Systems
Senior Principal Engineer, Wire Bond Equipment & Systems

Randstad Malaysia • Kuala Lumpur

On-site
MYR 300,000 - 520,000
MES-Driven Wire Bond & Die Attach Equipment Engineer
MES-Driven Wire Bond & Die Attach Equipment Engineer

118-WW TMG MFG OPS • Kuala Lumpur

On-site
MYR 120,000 - 180,000
Wire Bond Process Engineer — Yield & Innovation
Wire Bond Process Engineer — Yield & Innovation

Mini-Circuits Technologies (Malaysia) Sdn Bhd • Penang

On-site
MYR 60,000 - 90,000
Die Bond & Attach Equipment Lead — Uptime & Innovation
Die Bond & Attach Equipment Lead — Uptime & Innovation

118-WW TMG MFG OPS • Kuala Lumpur

On-site
MYR 180,000 - 240,000
Senior Wire Bond Process Engineer
Senior Wire Bond Process Engineer

Osram (Malaysia) Sdn Bhd • Penang

On-site
MYR 120,000 - 180,000