Staff Die Bond Process Engineer: Lead Quality & NPI

Nexperia

Seremban

On-site

MYR 140,000 - 210,000

Full time

5 days ago

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Job summary

Nexperia in Seremban, Malaysia, is seeking a Die Bond Process Staff Engineer to lead all Die Bond manufacturing activities and drive world-class quality, yield, and reliability. You will supervise a team of Process Engineers, collaborate with Production, Equipment Engineering, Quality, R&D, Customers, and Suppliers, and push for continuous improvement and successful NPI.

You will own die attach technologies, optimize processes, develop control plans, and guide root-cause analyses using advanced

Qualifications

Bachelor's or master's degree in engineering (Electrical, Electronic, Mechanical, Materials, Physics, or equivalent).
Minimum 10 years of semiconductor assembly experience with at least 5 years in Die Bond process leadership.

Responsibilities

Own and manage all Die Bond process technologies including epoxy die attach and advanced die attach processes.
Drive Die Bond process optimization to improve yield and equipment utilization.
Establish and maintain critical process controls for placement accuracy, epoxy coverage, voids, and package reliability.
Lead RCAs for Die Bond quality excursions using 8D, DMAIC, Fishbone, DOE, and statistics.
Develop qualification plans for new materials, equipment, and technology transfers.
Lead NPI and package transfer activities for Die Bond processes.
Monitor KPIs like Yield, Die Placement, Void Rate, OEE, MTBA, and Customer Complaint Rate.