Assistant Engineer, Die Bond & Wire Bond NPI

Vishay Intertechnology

Malacca City

On-site

MYR 39,000 - 61,000

Full time

12 days ago

Application generator

Stand out for this role — generate a tailored resume and cover letter in about a minute.

Get past ATS filters

Job summary

Vishay Semiconductor Malaysia Sdn. Bhd. is seeking an Assistant Engineer to support development and optimization of Die Bond and Wire Bond assembly processes for new product introductions (NPI) in Krubong, Melaka, Malaysia.

The role involves planning engineering builds, conducting DOE and process characterization, and generating technical reports. The candidate should have a Diploma in Engineering (Semiconductor Technology or related field) and at least 2 years of relevant experience, with

Qualifications

Diploma in Engineering in a relevant semiconductor field.
Minimum of 2 years of relevant working experience.
Basic understanding of semiconductor assembly and packaging processes.
Knowledge of Die Bond and Wire Bond processes, SPC, DOE, and problem-solving methodologies.

Responsibilities

Support development and optimization of Die Bond and Wire Bond assembly processes for new product introductions (NPI).
Plan and execute engineering builds, DOE, and process characterization activities.
Collect, analyze, and interpret engineering data from process trials and qualifications.
Generate technical reports, qualification summaries, and presentations.
Support evaluation and qualification of new Die Bond and Wire Bond equipment.