Senior Staff Engineer - Die Bond Process Excellence

Infineon Technologies AG; Malacca City; On-site; MYR 180,000 - 300,000; Full time

Job summary

Infineon Technologies AG in Malacca seeks a Senior Staff Engineer to lead die bond and front‑of‑line process development. You will drive robust manufacturing processes, mentor teams, and deliver improvements in yield, quality, and cost.

The role requires 8+ years in FOL/Die Bond, strong data analytics, and proven troubleshooting skills. You will collaborate across functions to ensure reliable, scalable production and continuous improvement. Experience in semiconductor assembly is essential.

Qualifications

• Bachelor's degree in an engineering field listed in the qualifications.
• 8+ years in FOL/Die Bond or semiconductor assembly environments.
• Strong data analysis, analytical thinking and problem-solving skills.
• Proven ability to anticipate issues and implement solutions quickly.
• Expert process engineering knowledge with manufacturing equipment familiarity.
• Ability to use 8D, DMAIC, Process Mapping, FTA, Fishbone diagrams.

Responsibilities

• Develop robust manufacturing processes and lead improvements for yield/quality KPIs.
• Sustain and enhance process performance to meet customer expectations on cost and delivery.
• Ensure control plan deployment and quality control requirements are met.
• Demonstrate expertise in Front‑of‑Line Die Bond processes.
• Deliver measurable business impact within the unit.

Skills

Statistical data analysis

Analytical thinking

Problem-solving

Structured problem-solving

Cross-functional communication

Education

Bachelor's degree in Mechanical/Electrical/Electronics/Mechatronics/Semiconductor Technology

Tools

8D

DMAIC

Process Mapping

FTA

Fishbone Diagram

Job description

Infineon Technologies AG in Malacca seeks a Senior Staff Engineer to lead die bond and front‑of‑line process development. You will drive robust manufacturing processes, mentor teams, and deliver improvements in yield, quality, and cost.

The role requires 8+ years in FOL/Die Bond, strong data analytics, and proven troubleshooting skills. You will collaborate across functions to ensure reliable, scalable production and continuous improvement. Experience in semiconductor assembly is essential.