Staff Process Engineer (Die Attach)

Nexperia; Seremban; On-site; MYR 140,000 - 210,000; Full time

Job summary

Nexperia in Seremban, Malaysia, is seeking a Die Bond Process Staff Engineer to lead all Die Bond manufacturing activities and drive world-class quality, yield, and reliability. You will supervise a team of Process Engineers, collaborate with Production, Equipment Engineering, Quality, R&D, Customers, and Suppliers, and push for continuous improvement and successful NPI.

You will own die attach technologies, optimize processes, develop control plans, and guide root-cause analyses using advanced

Qualifications

• Bachelor's or master's degree in engineering (Electrical, Electronic, Mechanical, Materials, Physics, or equivalent).
• Minimum 10 years of semiconductor assembly experience with at least 5 years in Die Bond process leadership.

Responsibilities

• Own and manage all Die Bond process technologies including epoxy die attach and advanced die attach processes.
• Drive Die Bond process optimization to improve yield and equipment utilization.
• Establish and maintain critical process controls for placement accuracy, epoxy coverage, voids, and package reliability.
• Lead RCAs for Die Bond quality excursions using 8D, DMAIC, Fishbone, DOE, and statistics.
• Develop qualification plans for new materials, equipment, and technology transfers.
• Lead NPI and package transfer activities for Die Bond processes.
• Monitor KPIs like Yield, Die Placement, Void Rate, OEE, MTBA, and Customer Complaint Rate.

Skills

Die Bond process

Root cause analysis

Statistical methods

Education

Bachelor's or Master's in Engineering

Tools

JMP

Minitab

Excel

Job description

Position Overview

As a Die Bond Process Staff Engineer, you will be responsible for leading and managing all Die Attach/Die Bond manufacturing processes to achieve world-class quality, yield, productivity, and reliability performance. The role is accountable for process development, optimization, qualification, and sustaining activities while ensuring robust process control, continuous improvement, and successful new product introduction (NPI). You will lead a team of Process Engineers and work closely with Production, Equipment Engineering, Quality, R&D, Customers, and Suppliers to drive operational excellence and meet business objectives.

Key Responsibilities (Die Bond Specific)

• Own and manage all Die Bond process technologies, including epoxy die attach, Eutectic die bond process, and advanced die attach processes as applicable.
• Drive Die Bond process optimization improves yield, eliminates defects, and enhances equipment utilization.
• Establish and maintain critical process controls for die placement accuracy, bond line thickness, epoxy coverage, void performance, die shear strength, and overall package reliability.
• Lead root cause analysis and corrective actions for Die Bond-related quality excursions using 8D, DMAIC, Fishbone, DOE, and statistical methodologies.
• Develop and execute process qualification plans for new materials, equipment, packages, and technology transfers.
• Partner with Equipment Engineering to improve machine capability, preventive maintenance strategies, uptime, OEE, and MTBA performance.
• Lead NPI and package transfer activities involving Die Bond process development, validation, and volume ramp-up.
• Monitor and improve key Die Bond KPIs including: Die Placement Accuracy Epoxy Coverage Performance Voids Performance Die Shear Strength Yield Loss OEE MTBA Customer Complaint Rate.
• Drive process characterization activities using DOE and statistical analysis to define process windows and improve robustness.
• Ensure compliance with IATF16949, customer requirements, Control Plans, PFMEA, SPC, and other quality management system requirements.
• Lead customer audits, qualification reviews, failure analysis discussions, and technical presentations related to Die Bond processes.
• Build technical competency of engineers, technicians, and operators through training, coaching, and mentoring.

Skills / Competencies

Hard Competencies

• Expert knowledge of Die Bond process and equipment.
• Strong understanding of semiconductor packaging technologies.
• Advanced DOE, SPC, MSA, PFMEA, Control Plan, and Statistical Analysis.
• Failure Analysis and Root Cause Investigation.
• Process Characterization and Validation (IQ/OQ/PQ).
• Knowledge of epoxy materials, solder attach, sintering, and packaging reliability.
• Strong data analytics capability using JMP, Minitab, Excel, or equivalent tools.

Soft Competencies

• Strategic leadership and talent development.
• Effective stakeholder management.
• Strong communication and influencing skills.
• Results-oriented and customer-focused mindset.
• Cross-functional collaboration and project leadership.

Job Specifications

• Bachelor's Degree or master's degree in engineering (Electrical, Electronic, Mechanical, Material Science, Physics, or equivalent).
• Minimum of 10 years of semiconductor assembly experience with at least 5 years in Die Bond process engineering leadership.
• Proven experience managing engineers and technical teams.
• Strong expertise in Die Bond equipment, materials, and process optimization.
• Experience in NPI, package transfer, and high-volume manufacturing environments.
• Familiar with Automotive Quality Standards (IATF16949, VDA, APQP, PPAP, FMEA).
• Experience supporting customer audits and problem-solving activities.
• Knowledge of Wire Bond interaction effects and package reliability is an advantage.

KPIs (Die Bond Focus)

• Die Bond Yield
• Die Placement Accuracy Performance
• Epoxy Defect PPM
• Void Rate
• Die Shear Performance
• OEE / Uptime
• MTBA
• Customer Complaint Rate
• Hold Lot Rate
• Action Closure Rate
• Process Capability (Cp/Cpk)
• Cost Reduction Achievement

Talent acquisition based on Nexperia vacancies is not appreciated.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested. In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.

Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 12,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face.

We support, reward and challenge individuals equally, in a dynamic and energetic environment.

Looking to push boundaries in a company where your talents can shine? Join TeamNexperia.