Senior Substrate & Lead Frame Design Engineer

Infineon Technologies; Malacca City; On-site; MYR 120,000 - 180,000; Full time

Job summary

Infineon Technologies Malaysia is seeking a Senior Packaging Development Engineer to drive substrates, lead frames and packing material development, ensuring DM, quality and cost targets. You will design and specify substrates/lead frames per guidelines and collaborate with internal teams and suppliers to meet milestones.

The role requires a Bachelor’s in Engineering with 7+ years in semiconductor assembly/packaging, CAD/Cadence experience, GD&T and strong analytical skills.

Qualifications

• Bachelor’s degree in Engineering with 7+ years in semiconductor assembly/packaging.
• Experience in substrates/lead frame/packing material development and qualification.
• Proficient in 2D/3D drafting using AutoCAD or Inventor.
• Cadence-based multi-layer substrate design knowledge.
• Solid knowledge of GD&T and material specification.
• Strong analytical and problem-solving abilities.
• Foundational knowledge of semiconductor packaging, assembly and test.
• Experience in material development, analysis, qualification and reliability.

Responsibilities

• Technical expert for substrates, lead frames, and packing materials in package development projects.
• Perform design, drawings, and specifications per guidelines for manufacturing, quality and cost.
• Collaborate with internal teams and suppliers on material design and selection.
• Drive development activities and ensure milestones, cost and documentation release.
• Work with SQM, IQA and suppliers to ensure quality and qualification release.
• Establish design guidelines for substrates/lead frames/material specifications.
• Generate technical papers and patents related to substrate and lead frame designs.
• Provide support in incoming material quality and issue resolution.
• Engage suppliers to explore new tech and achieve cost advantages.

Skills

Lead frame design

2D/3D drafting

Cadence design

GD&T knowledge

Analytical skills

Packaging basics

Reliability qualification

Education

Bachelor's degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics)

Tools

AutoCAD

Inventor

Cadence

Job description

Infineon Technologies Malaysia is seeking a Senior Packaging Development Engineer to drive substrates, lead frames and packing material development, ensuring DM, quality and cost targets. You will design and specify substrates/lead frames per guidelines and collaborate with internal teams and suppliers to meet milestones.

The role requires a Bachelor’s in Engineering with 7+ years in semiconductor assembly/packaging, CAD/Cadence experience, GD&T and strong analytical skills.