Lead Frame & Packaging Materials Engineer (Staff, R&D)

Infineon Technologies (Malaysia) Sdn Bhd

Malacca City

On-site

MYR 250,000 - 420,000

Full time

5 days ago

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Job summary

Infineon Technologies (Malaysia) Sdn Bhd is seeking a Staff Engineer Lead Frame / Packing Materials in its Research & Development team. You will lead technical development for lead frames, substrates, and packing materials, and design to meet manufacturing and cost targets.

The role requires 7+ years in semiconductor packaging, heavy drafting in AutoCAD/Inventor/Cadence, and strong material property knowledge.

Qualifications

Bachelor’s Degree in Engineering in semiconductor-related fields.
Minimum 7 years in semiconductor assembly and packaging development.
Lead frame, substrate, and packing material development and qualification.
2D/3D drafting using AutoCAD, Inventor, or Cadence.
G&D&T and material specification definition.
Knowledge of packaging, assembly, and test in semiconductors.

Responsibilities

Serve as the technical expert for lead frame, substrate, and packing material development in package projects.
Design, draw, and specify lead frames/substrates per guidelines, assembly rules, quality and cost needs.
Collaborate with internal stakeholders and suppliers on packing materials.
Drive development activities to meet milestones and release specs and docs.
Coordinate with SQM and suppliers for quality, FAI, and qualification releases.
Develop and maintain design guidelines and specifications for lead frames, substrates, packing materials.
Generate technical papers, journals, and patents related to design.
Support incoming material quality activities with suppliers and internal teams.
Participate in roadmapping, UPEG activities, and material selection to meet roadmap needs.
Engage suppliers to explore new technologies and cost-effective design solutions.