Senior Staff Engineer Substrate Designer

Infineon Technologies AG; Malacca City; On-site; MYR 70,000 - 100,000; Full time

Job summary

Infineon Technologies AG in Malaysia is seeking an experienced technical expert in substrates, lead frames, and packing materials for critical development projects. You will collaborate with internal teams and suppliers, driving activities to meet quality and manufacturing requirements.

The ideal candidate holds a Bachelor's Degree in Engineering with at least 7 years of experience in semiconductor assembly and packaging, proficient in AutoCAD and Cadence design tools. The role supports innovation and fosters an inclusive work environment.

Qualifications

• At least 7 years of working experience in semiconductor assembly and packaging development.
• Knowledge in GD&T and material specification definition.
• Experience in material development, analysis, qualification, and reliability.

Responsibilities

• Drive substrates, lead frames & packing material development activities.
• Collaborate with teams and suppliers on design and specification.
• Generate technical papers related to designs and enhancements.

Skills

Substrates/Lead frames design/packing material development

Analytical and problem-solving skills

Knowledge of material physics/properties

Drafting / designing (2D & 3D) Lead Frame using AutoCAD/Inventor

Multi-layer substrate designing using Cadence

Education

Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics)

Tools

AutoCAD

Inventor

Cadence

Job description

Drive substrates, lead frames & packing material development activities to ensure the package fulfills all requirements in manufacturing, product qualification, and reliability.

Your Role

Key responsibilities in your new role

• Technical expert for substrates, lead frame / packing material in package development projects
• Perform design, drawing, and specification for substrates & lead frames based on design guideline, assembly rules and ensure design for manufacturing, quality, and cost
• Collaborate with internal teams and material suppliers on packing material design, specification and selection; and ensure design for manufacturing, quality, and cost
• Drive substrates / lead frame / packing material development activities and ensure fulfilment of project milestone deliverables, cost and documentation release (spec, drawing, GIMM, etc)
• Work closely with Supplier Quality Management, IQA and supplier to ensure fulfilment of quality requirement / FAI for lead frame / packing material; and qualification release
• Establish design guideline / requirement for substrates / lead frame / packing material specification
• Generate technical papers / journals and patents related to substrate & lead frame designs, package design that enhances technical value
• Provide support in incoming material quality, work with suppliers / internal to resolve technology / quality issue, improvement programs, and etc
• Actively engage with substrates / lead frame / packing material suppliers to explore new technology, best in cost design, and etc to achieve competitive advantages

Your Profile

Qualifications and skills to help you succeed

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics) with at least 7 years of working experience in semiconductor assembly and packaging development; or relevance experience in substrates/lead frame/Packing Material is preferred
• Substrates/Lead frames design/packing material development & qualification
• Knowledge of drafting / designing (2D & 3D) Lead Frame using AutoCAD / Inventor
• Multi-layer substrate designing using Cadence
• Knowledge in material physics / properties for PCB/laminate substrates, lead frames, and packing material
• Good in GD&T knowledge / material specification definition
• Possess strong analytical and problem-solving skills
• Basic knowledge in semiconductor packaging, assembly, and test
• Experience in material development, analysis, qualification, and reliability

Equal Opportunity Statement

We embrace diversity and inclusion and welcome everyone for who they are. At Infineon we offer a working environment characterized by trust, openness, respect and tolerance and are committed to giving all applicants and employees equal opportunities.