Senior Package Development Engineer — Semiconductors

Infineon Technologies (Malaysia) Sdn Bhd

Malacca City

On-site

MYR 60,000 - 80,000

Full time

35 hours ago
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Job summary

Infineon Technologies (Malaysia) Sdn Bhd is seeking a packaging engineer to define and develop the right package for new products from concept to realization. You will drive technical definition activities for package development projects, including BOM, package design, assembly technology, PRP review, and project classification.

You will generate outlines, finalize drawings, define characteristics to meet electrical, thermal, mechanical, and reliability requirements, and coordinate cost

Qualifications

  • Bachelor’s degree in Engineering or related field; semiconductor focus preferred.
  • 2–3 years in IC/semiconductor manufacturing environment.
  • Knowledge of semiconductor packaging, assembly and testing processes.
  • Understanding of failure analysis and reliability methodologies.

Responsibilities

  • Drive technical definition activities for package development projects (BOM, design, assembly tech, PRP review).
  • Generate package outlines and internal drawings; finalize and maintain package documentation.
  • Define package characteristics to meet electrical, thermal, mechanical and reliability requirements.
  • Coordinate package cost estimation (A1–A3) and cost indication (A3) activities.
  • Collaborate with BE assembly technologies to define package solutions for back-end processes.
  • Provide pre-development support and act as the package design expert throughout the project lifecycle.

Skills

IC Packaging
Semiconductor Packaging
AutoCAD
3D Drafting
Reliability Engineering

Education

Bachelor's Degree in Engineering

Tools

AutoCAD
3D Drafting Tools

Job description

Infineon Technologies (Malaysia) Sdn Bhd is seeking a packaging engineer to define and develop the right package for new products from concept to realization. You will drive technical definition activities for package development projects, including BOM, package design, assembly technology, PRP review, and project classification.

You will generate outlines, finalize drawings, define characteristics to meet electrical, thermal, mechanical, and reliability requirements, and coordinate cost

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