Principal Engineer, Semiconductor Packaging & Innovation

Infineon Technologies; Malacca City; On-site; MYR 300,000 - 600,000; Full time

Job summary

Infineon Technologies in Malaysia seeks a Principal Engineer for Package Technology to lead packaging solution development from concept through realization. You will be the technical expert for package design, assembly technologies and BE processes, driving innovation and cross-functional collaboration across teams and projects.

The role demands deep expertise in packaging, strong analytical and negotiation skills, and the ability to develop robust, competitive solutions while advancing

Qualifications

• Deep expertise in semiconductor packaging, assembly and test technologies.
• Strong understanding of BE processes, materials, package reliability, and quality requirements.
• Excellent analytical, communication, negotiation and stakeholder management skills.

Responsibilities

• Lead the definition, design and development of packaging solutions from concept to realization.
• Act as technical expert and consultant for package design and assembly technologies.
• Drive innovation, cross-functional collaboration, technology scouting and knowledge creation.

Skills

semiconductor packaging

assembly & test tech

BE processes

stakeholder management

Education

Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics, Physics)

Job description

Infineon Technologies in Malaysia seeks a Principal Engineer for Package Technology to lead packaging solution development from concept through realization. You will be the technical expert for package design, assembly technologies and BE processes, driving innovation and cross-functional collaboration across teams and projects.

The role demands deep expertise in packaging, strong analytical and negotiation skills, and the ability to develop robust, competitive solutions while advancing