Senior Staff Engineer Substrate Designer

Infineon Technologies; Malacca City; On-site; MYR 120,000 - 180,000; Full time

Job summary

Infineon Technologies Malaysia is seeking a Senior Packaging Development Engineer to drive substrates, lead frames and packing material development, ensuring DM, quality and cost targets. You will design and specify substrates/lead frames per guidelines and collaborate with internal teams and suppliers to meet milestones.

The role requires a Bachelor’s in Engineering with 7+ years in semiconductor assembly/packaging, CAD/Cadence experience, GD&T and strong analytical skills.

Qualifications

• Bachelor’s degree in Engineering with 7+ years in semiconductor assembly/packaging.
• Experience in substrates/lead frame/packing material development and qualification.
• Proficient in 2D/3D drafting using AutoCAD or Inventor.
• Cadence-based multi-layer substrate design knowledge.
• Solid knowledge of GD&T and material specification.
• Strong analytical and problem-solving abilities.
• Foundational knowledge of semiconductor packaging, assembly and test.
• Experience in material development, analysis, qualification and reliability.

Responsibilities

• Technical expert for substrates, lead frames, and packing materials in package development projects.
• Perform design, drawings, and specifications per guidelines for manufacturing, quality and cost.
• Collaborate with internal teams and suppliers on material design and selection.
• Drive development activities and ensure milestones, cost and documentation release.
• Work with SQM, IQA and suppliers to ensure quality and qualification release.
• Establish design guidelines for substrates/lead frames/material specifications.
• Generate technical papers and patents related to substrate and lead frame designs.
• Provide support in incoming material quality and issue resolution.
• Engage suppliers to explore new tech and achieve cost advantages.

Skills

Lead frame design

2D/3D drafting

Cadence design

GD&T knowledge

Analytical skills

Packaging basics

Reliability qualification

Education

Bachelor's degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics)

Tools

AutoCAD

Inventor

Cadence

Job description

Drive substrates, lead frames & packing material development activities to ensure the package fulfill all requirement in the aspect of manufacturing, product qualification, and reliability.

Your Role

• Technical expert for substrates, lead frame / packing material in package development projects
• Perform design, drawing, and specification for substrates & lead frames based on design guideline, assembly rules and ensure design for manufacturing, quality, and cost
• Collaborate with internal teams and material suppliers on packing material design, specification and selection; and ensure design for manufacturing, quality, and cost
• Drive substrates/lead frame/packing material development activities and ensure fulfilment of project milestone deliverables, cost and documentation release (spec, drawing, GIMM, etc)
• Work closely with Supplier Quality Management, IQA and supplier to ensure fulfilment of quality requirement / FAI for lead frame / packing material; and qualification release
• Establish design guideline / requirement for substrates / lead frame / packing material specification
• Generate technical papers / journals and patents related to substrate & lead frame designs, package design that enhances technical value
• Provide support in incoming material quality, work with suppliers / internal to resolve technology / quality issue, improvement programs, and etc
• Actively engages with substrates/lead frame/packing material suppliers to explore new technology, best in cost design, and etc to achieve competitive advantages

Your Profile

Qualifications And Skills To Help You Succeed

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics) with at least 7 years of working experience in semiconductor assembly and packaging development; or relevance experience in substrates/lead frame/Packing Material is preferred
• Substrates/Lead frames design/packing material development & qualification
• Knowledge of drafting / designing (2D & 3D) Lead Frame using AutoCAD / Inventor
• Multi-layer substrate designing using Cadence.
• Knowledge in material physics / properties for PCB/laminate substrates, lead frames, and packing material
• Good in GD&T knowledge / material specification definition
• Possess strong analytical and problem-solving skills
• Basic knowledge in semiconductor packaging, assembly, and test
• Experience in material development, analysis, qualification, and reliability

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

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