Lead Principal Engineer, Technology Integration & Packaging

Infineon Technologies (Malaysia) Sdn Bhd; Malacca City; On-site; MYR 320,000 - 520,000; Full time

Job summary

Infineon Technologies (Malaysia) Sdn Bhd is seeking a Lead Principal Engineer Technology Integration to drive technology integration activities, ensuring packages meet process interaction requirements. You will partner with FE teams on new FE technology and lead risk assessment work packages.

The role requires a strong background in IC/semiconductor packaging, DS & DFMEA, and collaboration across multiple functions to optimize package platforms and drive decarbonization and digitalization

Qualifications

• Bachelor’s Degree in Engineering with semiconductor tech/ME/EC knowledge.
• Strong communication, collaboration, negotiation and solution finding skills.
• Knowledge of FE/BE and BE/BE Interaction.
• Knowledge of 8D & T6s methodology.
• Knowledge of DFMEA/PFMEA.
• Knowledge of Internal Package analysis/ first level reliability.

Responsibilities

• PBC and TPC assessment.
• Driver of Package Technology DFMEA Process of Record.
• Owner of Risk Interaction assessment and mitigation work packages.
• Integration of unit processes (BOM and Process) in package platform.
• Working partner for FE in FE/BE interaction and integration topics.

Skills

Communication

Collaboration

Negotiation

Solution finding

FE/BE interaction

DFMEA/PFMEA

8D/T6s

Internal package analysis

Education

Bachelor’s Degree in Engineering

Job description

Infineon Technologies (Malaysia) Sdn Bhd is seeking a Lead Principal Engineer Technology Integration to drive technology integration activities, ensuring packages meet process interaction requirements. You will partner with FE teams on new FE technology and lead risk assessment work packages.

The role requires a strong background in IC/semiconductor packaging, DS & DFMEA, and collaboration across multiple functions to optimize package platforms and drive decarbonization and digitalization