Senior Staff Engineer, Package Technology

Infineon Technologies; Malacca City; On-site; MYR 120,000 - 190,000; Full time

Job summary

Infineon Technologies Malaysia in Malacca City is seeking a Senior Staff Engineer to lead advanced package technology in our Research & Development team. You will define packaging concepts, coordinate cross-functional activities, and shape the future of power and microelectronics packaging.

The role requires a bachelor's in engineering and at least seven years in IC/semiconductor packaging, plus strong analytical skills and proficiency with CAD tools.

Qualifications

• Bachelor's degree in engineering required.
• Minimum 7 years in IC or semiconductor industry.
• Strong knowledge of packaging, assembly and test processes.
• Knowledge of failure analysis and reliability engineering.
• Strong analytical and problem-solving skills.
• Proficiency in AutoCAD and 3D drafting preferred.

Responsibilities

• Drive technical definition activities for package projects with major changes or business impact.
• Develop conceptual package outlines and internal construction drawings; update drawings as required.
• Define package characteristics to meet electrical, thermal, mechanical and reliability needs.
• Coordinate package cost estimation activities (A1-A3) and cost indication (A3).
• Serve as liaison and technical consultant to Business Divisions on backend assembly tech.
• Support pre-development and project definition phases; act as package design expert.
• Scout emerging packaging technologies and monitor competitors and subcontractors.
• Consolidate inputs for ADR and ensure timely updates for A-projects.
• Act as primary contact, technical consultant, and coach for packaging topics.

Skills

Analytical thinking

Problem solving

CAD proficiency

Semiconductor packaging knowledge

Education

Bachelor's Degree in Engineering

Tools

AutoCAD

3D drafting

Job description

Infineon Technologies Malaysia in Malacca City is seeking a Senior Staff Engineer to lead advanced package technology in our Research & Development team. You will define packaging concepts, coordinate cross-functional activities, and shape the future of power and microelectronics packaging.

The role requires a bachelor's in engineering and at least seven years in IC/semiconductor packaging, plus strong analytical skills and proficiency with CAD tools.