Power Discrete Leadframe & Substrate Design Engineer

Carsem (M) Sdn. Bhd

Ipoh

On-site

MYR 180,000 - 260,000

Full time

8 days ago

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Job summary

Carsem seeks a seasoned Leadframe & Substrate Design Engineer to lead design, simulation, and rules development for advanced semiconductor packaging in Ipoh, Malaysia. You will drive sub-micron precision packaging within the Power Discrete segment, bridging CAD, multiphysics simulations, DFM/DFT, and customer-facing support.

You will collaborate with cross-functional teams to deliver robust designs, perform tolerance analyses, and ensure compliance with international standards.

Qualifications

7+ years hands-on experience in Leadframe and Substrate Design in Power Discrete.
Experience with Power Module Design is a strong plus.
CAD and simulation proficiency in SolidWorks/AutoCAD/Creo and FEA tools like ANSYS/COMSOL.

Responsibilities

Lead 3D mechanical modeling and simulation of leadframes and substrates.
Develop GD&T for sub-micron precision packaging components.
Perform thermal-mechanical and electrical parasitic modeling for high-power packaging.
Conduct FEA to mitigate design risks (stress, warpage, thermal management).
Develop and update internal DFM/DFT rules, collaborating with cross-functional teams and customers.

Skills

Leadframe design

Substrate design

GD&T

FEA/multiphysics

Thermal modeling

Customer engagement

Multiphysics simulation

Tools

SolidWorks

AutoCAD

Creo

ANSYS

COMSOL

Job description

You will collaborate with cross-functional teams to deliver robust designs, perform tolerance analyses, and ensure compliance with international standards.

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