Power Package Design Engineer for AI/HPC Systems

Renesas Electronics Corp.; Bayan Lepas; On-site; MYR 120,000 - 180,000; Full time

Job summary

Renesas Electronics is leading the development of advanced packaging technologies for AI-enabled devices and HPC systems. The role focuses on power SiP/modules, flip-chip LGA, and multi-chip module packaging to support high density and high reliability requirements.

As a packaging engineer, you will collaborate with OSAT/CM partners, Product Groups and Reliability teams to qualify new packages, develop DOE-driven process optimizations, and ensure a smooth transition into production while

Qualifications

• Master's or Bachelor's in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 5–15 years of package development experience focusing on leadframe, laminate, power QFN/SiP/module, flip-chip packaging, and wafer Front-Side (FSM) / Back-Side (BM) Metallization processing.
• Knowledge of wafer front-side / backside metallization, wire-bonding, flip chip, multi-chip module, SPC (Statistical Process Control) and statistical analysis.

Responsibilities

• Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, flip-chip LGA, multi-chip module and power device packaging.
• Work with OSAT/CM to develop, run DOEs to optimize processes and establish process specifications.
• Work with Product Groups and Reliability teams to qualify new packages and processes within required time frame.
• Ensure smooth transition into production by resolving all process integration issues, establishing production controls and monitors, and monitoring / resolving process issues.
• Develop and maintain technical expertise on advances and innovations in advanced leadframe, power SiP/modules, and flip chip interconnects.
• Address internal and external customer complaints working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.

Skills

Strong interpersonal and communication

Strong analytical and presentation

Education

Master's / Bachelor's in Physics, Chemistry, Mechanical, Electrical or Materials Engineering

Tools

AutoCAD

Excel

PowerPoint

Word

SPC

Statistical analysis

Job description

Renesas Electronics is leading the development of advanced packaging technologies for AI-enabled devices and HPC systems. The role focuses on power SiP/modules, flip-chip LGA, and multi-chip module packaging to support high density and high reliability requirements.

As a packaging engineer, you will collaborate with OSAT/CM partners, Product Groups and Reliability teams to qualify new packages, develop DOE-driven process optimizations, and ensure a smooth transition into production while