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Renesas Electronics in Malaysia seeks a Senior Manager of Semiconductor IC Packaging & Assembly Engineering to lead sustaining engineering and high‑volume manufacturing for advanced packaging technologies. The role focuses on AI/data center power packaging applications, including Smart Power Stages, WBG technologies, and high‑volume ramp readiness.
You will guide process control, yield improvement, and cross‑functional collaboration with Package Engineering, R&D, Quality, Supply Chain, and
Renesas Electronics in Malaysia seeks a Senior Manager of Semiconductor IC Packaging & Assembly Engineering to lead sustaining engineering and high‑volume manufacturing for advanced packaging technologies. The role focuses on AI/data center power packaging applications, including Smart Power Stages, WBG technologies, and high‑volume ramp readiness.
You will guide process control, yield improvement, and cross‑functional collaboration with Package Engineering, R&D, Quality, Supply Chain, and