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Renesas Electronics is seeking a Senior Manager for Semiconductor IC Packaging & Assembly Engineering in Malaysia. This role leads sustaining and HVM efforts across advanced packaging techniques, focusing on AI/data center power packaging and SiC/GaN technologies.
The job requires strong cross‑functional collaboration with Package Engineering, Quality, Supply Chain, and OSAT partners to ensure ramp readiness and cost-competitive production.
Renesas Electronics is seeking a Senior Manager for Semiconductor IC Packaging & Assembly Engineering in Malaysia. This role leads sustaining and HVM efforts across advanced packaging techniques, focusing on AI/data center power packaging and SiC/GaN technologies.
The job requires strong cross‑functional collaboration with Package Engineering, Quality, Supply Chain, and OSAT partners to ensure ramp readiness and cost-competitive production.