Packaging Systems Engineer - Power QFN/SiP & Flip-Chip

SmartRecruiters, Inc.; Bayan Lepas; On-site; MYR 90,000 - 180,000; Full time

Job summary

Renesas Electronics invites applications for a packaging engineer to design and develop power packaging solutions, including Power SiP/modules and flip-chip interconnects. You will collaborate with OSAT/CM and product groups to optimize processes and qualify new packages within deadlines.

Ideal candidates have 5–15 years in leadframe, laminate and Wafer Front/Backside metallization, with strong communication and analytical skills to drive transitions to production and resolve process issues.

Qualifications

• Degree in physics, chemistry, mechanical, electrical or materials engineering.
• 5-15 years of package development experience emphasizing leadframe, laminate, power QFN/SiP/module, and flip-chip packaging.
• Understanding of semiconductor power device package assembly processes, materials and technology.

Responsibilities

• Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, flip-chip LGA, multi-chip module and power device packaging
• Work with OSAT/CM to develop, run DOEs to optimize processes and establish process specifications.
• Work with Product Groups and Reliability teams to qualify new packages and processes within required time frame.
• Ensure smooth transition into production by resolving all process integration issues, establishing production controls and monitors, and monitoring / resolving process issues.
• Develop and maintain technical expertise on advances and innovations in advanced leadframe, power SiP/modules, and flip chip interconnects.
• Address internal and external customer complaints working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.

Skills

Interpersonal skills

Analytical skills

Presentation skills

Education

Bachelor’s/Master’s in Physics

Chemistry

Mechanical Engineering

Electrical Engineering

Materials Engineering

Tools

AutoCAD

Excel

PowerPoint

Word

Job description

Renesas Electronics invites applications for a packaging engineer to design and develop power packaging solutions, including Power SiP/modules and flip-chip interconnects. You will collaborate with OSAT/CM and product groups to optimize processes and qualify new packages within deadlines.

Ideal candidates have 5–15 years in leadframe, laminate and Wafer Front/Backside metallization, with strong communication and analytical skills to drive transitions to production and resolve process issues.